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KSZ8051MNLI-TR
Microchip Technology
IC TRANSCEIVER FULL 1/1 32QFN
2205 Pcs New Original In Stock
1/1 Transceiver Full MII 32-QFN (5x5)
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Minimum 1
5.0 / 5.0
- (382 Ratings)
KSZ8051MNLI-TR
Product Overview
1338319
DiGi Electronics Part Number
KSZ8051MNLI-TR-DGManufacturer
Microchip Technology
KSZ8051MNLI-TR
Description
IC TRANSCEIVER FULL 1/1 32QFNInventory
2205 Pcs New Original In Stock
1/1 Transceiver Full MII 32-QFN (5x5)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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KSZ8051MNLI-TR Technical Specifications
Category
Interface, Drivers, Receivers, Transceivers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Obsolete
Type
Transceiver
Protocol
MII
Number of Drivers/Receivers
1/1
Duplex
Full
Data Rate
-
Voltage - Supply
1.8V, 2.5V, 3.3V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Supplier Device Package
32-QFN (5x5)
Base Product Number
KSZ8051
Datasheet & Documents
HTML Datasheet
KSZ8051MNLI-TR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
5A991B1
HTSUS
8542.39.0001
Additional Information
Other Names
576-3901-2
576-3901-1
576-3901-6
KSZ8051MNLITR
KSZ8051MNLI TR
Standard Package
1,000
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
チェックアウトの手続きがシンプルで迷うことなく進められました。
de desembre 02, 2025
スタッフの対応が丁寧で、アフターサービスも優れています。価格も魅力的です。
de desembre 02, 2025
DiGi Electronics consistently delivers products on time, which helps our project deadlines stay on track.
de desembre 02, 2025
DiGi Electronics consistently meets my expectations for quality and support.
de desembre 02, 2025
I appreciate the attention to detail in the product, which indicates high quality.
de desembre 02, 2025
I appreciate the prompt and friendly responses from their customer support team.
de desembre 02, 2025
Their dedicated after-sales support enhances the overall customer experience.
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Frequently Asked Questions (FAQ)
Can KSZ8051MNLI-TR be used as a drop-in replacement for DP83848CSQ/NOPB in a new Ethernet design, and what are the key integration risks?
The KSZ8051MNLI-TR is not a direct drop-in replacement for TI's DP83848CSQ/NOPB due to differences in pinout and internal PHY register mapping, despite both supporting MII and operating at 3.3V. A critical design risk involves the KSZ8051MNLI-TR’s requirement for 1.8V for the I/O supply (VDDIO), whereas the DP83848 uses 3.3V throughout. Designers must verify level compatibility with the MAC side and update the PCB layout to accommodate the 5x5 QFN footprint, which differs from the DP83848's package. Additionally, since the KSZ8051MNLI-TR is marked as obsolete, long-term supply and reliability in new designs should be evaluated—consider migration to active Microchip replacements like the KSZ8081MNXIA-TR with proper strap resistor and timing review.
What are the power supply sequencing requirements when integrating the KSZ8051MNLI-TR in a multi-voltage FPGA-based system?
When using the KSZ8051MNLI-TR with FPGAs or processors requiring tight power sequencing, ensure that the core supply (VDD33) reaches 3.3V before or concurrently with the I/O supply (VDDIO at 1.8V). While the KSZ8051MNLI-TR does not specify strict sequencing, applying VDDIO before VDD33 may risk internal cell contention due to mixed-signal domain coupling. A recommended design practice is to power both rails via a single dual-output regulator with simultaneous start-up, or use a small RC delay on the 1.8V enable to lag the 3.3V rail by 1–5 ms. This prevents latch-up during brown-out conditions and aligns with Microchip's general PHY reliability guidelines.
Is the KSZ8051MNLI-TR suitable for industrial temperature operation in harsh environments, and what PCB layout practices improve its long-term reliability?
Yes, the KSZ8051MNLI-TR is rated for -40°C to 85°C operation, making it suitable for industrial environments. However, its 32-QFN (5x5) exposed pad must be properly soldered to a ground thermal pad on the PCB to ensure mechanical stability and thermal dissipation. To enhance reliability, use a 0.3mm stencil thickness under the exposed pad to avoid voiding, and ensure at least four thermal vias connect the pad to an internal ground plane. Avoid placing thermal vias too close to pads to prevent solder wicking. Additionally, since this part is obsolete, consider accelerated life testing if used in high-vibration or high-humidity applications to mitigate end-of-life component risks.
How does the obsolete status of KSZ8051MNLI-TR impact its use in production designs, and what is the recommended upgrade path?
The obsolete status of the KSZ8051MNLI-TR means Microchip no longer guarantees long-term availability or wafer fabrication, posing a significant supply chain risk for production designs. While current stock exists, future lot purchases may be limited or discontinued without notice. For new designs, migrate to the recommended substitute, KSZ8081MNXIA-TR, which supports similar MII interfaces and voltage ranges but features enhanced ESD protection (8kV HBM vs 4kV) and is actively supported. Note that the KSZ8081 requires updated strap resistor configurations for mode selection and slightly different clock timing tolerances—validate register initialization and 25MHz reference clock stability during transition.
What are the signal integrity considerations when routing RMII/MII traces with the KSZ8051MNLI-TR on a 4-layer board?
When routing MII signals with the KSZ8051MNLI-TR, maintain controlled impedance (50–60Ω) on all transmit, receive, and clock lines, especially for TX_EN, TXD[3:0], and COL—these are sensitive to reflections due to full-duplex operation. Use a 4-layer stack-up with solid ground and power planes to minimize crosstalk. Keep trace lengths under 3 inches (7.6 cm) and match lengths within 100 mils differential pairs if applicable. Terminate the 25MHz REF_CLK with a series 33Ω resistor close to the source if routed over 2 inches. Avoid 90-degree bends and place decoupling capacitors (0.1µF) at each VDD pin to suppress high-frequency noise that can corrupt MII signaling.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
KSZ8051MNLI-TR CAD Models
Microchip Technology KSZ8051MNLI-TR PCB symbols & footprints
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