Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
ATSAMR21G18A-MFT
Microchip Technology
IC RF TXRX+MCU ISM>1GHZ 48VFQFN
1963 Pcs New Original In Stock
IC RF TxRx + MCU General ISM > 1GHz 2.4GHz 48-VFQFN Exposed Pad
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (444 Ratings)
ATSAMR21G18A-MFT
Product Overview
1423795
DiGi Electronics Part Number
ATSAMR21G18A-MFT-DGManufacturer
Microchip Technology
ATSAMR21G18A-MFT
Description
IC RF TXRX+MCU ISM>1GHZ 48VFQFNInventory
1963 Pcs New Original In Stock
IC RF TxRx + MCU General ISM > 1GHz 2.4GHz 48-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
ATSAMR21G18A-MFT Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SMART™ SAM R21
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
General ISM > 1GHz
Protocol
-
Modulation
O-QPSK
Frequency
2.4GHz
Data Rate (Max)
250kbps
Power - Output
4dBm
Sensitivity
-99dBm
Memory Size
256kB Flash, 32kB SRAM
Serial Interfaces
I2C, SPI, UART, USART, USB
GPIO
28
Voltage - Supply
1.8V ~ 3.6V
Current - Receiving
11.3mA ~ 11.8mA
Current - Transmitting
7.2mA ~ 13.8mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-QFN (7x7)
Base Product Number
ATSAMR21
Datasheet & Documents
HTML Datasheet
ATSAMR21G18A-MFT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
1611-ATSAMR21G18A-MFTDKR-DG
ATSAMR21G18A-MFTTR
1611-ATSAMR21G18A-MFTTR
1611-ATSAMR21G18A-MFTTRINACTIVE
ATSAMR21G18A-MFTCT
1611-ATSAMR21G18A-MFTCT
1611-ATSAMR21G18A-MFTCT-DG
1611-ATSAMR21G18A-MFTTR-DG
1611-ATSAMR21G18A-MFTDKRINACTIVE
1611-ATSAMR21G18A-MFTCTINACTIVE
ATSAMR21G18A-MFTDKR
1611-ATSAMR21G18A-MFTDKR
Standard Package
4,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
가성비 뛰어난 제품과 친환경 포장이 너무 만족스럽습니다.
de desembre 02, 2025
빠른 배송 덕분에 급하게 필요했는데 너무 좋아요.
de desembre 02, 2025
포장 상태가 최고였고 배송도 빠르게 이루어졌어요.
de desembre 02, 2025
Their stock replenishment process is smooth, preventing shortages.
de desembre 02, 2025
DiGi Electronics offers impressive value, with a website that’s easy to explore.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
Can the ATSAMR21G18A-MFT replace a legacy CC2530 in a 2.4GHz Zigbee sensor node without major firmware changes, and what are the key integration risks?
While the ATSAMR21G18A-MFT offers comparable 2.4GHz O-QPSK modulation and similar data rates to the CC2530, direct pin-to-pin or firmware replacement is not feasible due to architectural differences—the SAM R21 uses an ARM Cortex-M0+ core versus the 8051 in the CC2530. You’ll need to rewrite application code and adapt the RF stack, as Microchip’s Zigbee stack (or 6LoWPAN via IEEE 802.15.4) differs from TI’s Z-Stack. Key risks include increased development time, potential RF performance tuning (e.g., antenna matching), and power profile mismatches during sleep modes. Always validate current consumption under real-world duty cycles, as the ATSAMR21G18A-MFT’s 11.8mA RX current may exceed legacy assumptions.
What design constraints should I consider when using the ATSAMR21G18A-MFT in a battery-powered IoT device with strict <10µA sleep current targets?
The ATSAMR21G18A-MFT can meet ultra-low-power requirements, but achieving <10µA sleep current demands careful configuration: disable unused peripherals, use the internal 32kHz oscillator for RTC wake-up, and ensure GPIOs are in high-impedance state with no leakage paths. However, the exposed pad (EP) must be properly grounded to maintain thermal and RF stability—poor soldering here increases quiescent current. Also, note that enabling the USB interface (even in suspend mode) can add microamp-level leakage; if USB isn’t needed, avoid configuring those pins. Validate sleep current across the full -40°C to 125°C range, as leakage rises significantly at high temperatures.
How does the ATSAMR21G18A-MFT compare to the nRF52840 for a multi-protocol 2.4GHz design requiring both BLE and proprietary sub-GHz fallback?
The ATSAMR21G18A-MFT only supports 2.4GHz IEEE 802.15.4 (e.g., Zigbee, Thread), while the nRF52840 supports BLE and proprietary 2.4GHz protocols—but neither natively handles sub-GHz. For a dual-band solution, you’d need an external sub-GHz transceiver with either MCU, increasing BOM cost and complexity. The ATSAMR21G18A-MFT has superior RF sensitivity (-99dBm vs. -96dBm for nRF52840) and lower TX current at +0dBm (7.2mA vs. 8.5mA), making it better for long-range 2.4GHz mesh networks. However, the nRF52840 offers more Flash (1MB vs. 256kB) and hardware crypto—choose based on protocol needs and memory constraints.
What are the reliability risks of using the ATSAMR21G18A-MFT in an industrial environment with frequent thermal cycling between -30°C and 110°C?
Although the ATSAMR21G18A-MFT is rated for -40°C to 125°C, repeated thermal cycling stresses the 48-VFQFN package, especially at the exposed pad solder joints—the primary thermal and mechanical anchor. MSL 3 (168 hours floor life) requires strict moisture control; exposure beyond this risks popcorning during reflow. Mitigate by baking PCBs pre-assembly if stored >168hrs and using void-reducing solder paste. Also, ensure PCB pad design follows Microchip’s recommended thermal land pattern (7x7mm with via array) to prevent pad lifting. Monitor long-term RF performance, as cracked solder joints can cause impedance mismatches and reduced range.
Can I use the ATSAMR21G18A-MFT’s USB interface for field firmware updates in a sealed enclosure, and what design pitfalls should I avoid?
Yes, the ATSAMR21G18A-MFT’s full-speed USB 2.0 interface enables in-field updates via DFU (Device Firmware Upgrade), but this introduces several design risks: First, USB signals (D+/D−) require 90Ω differential impedance routing and ESD protection (e.g., USB6B5T1W), which adds cost in space-constrained designs. Second, enabling USB increases susceptibility to RF interference—keep USB traces away from the antenna path and use ground shielding. Third, if the device operates on battery, USB suspend current must be minimized (<500µA); disable VBUS sensing if unused. Finally, ensure your bootloader supports robust error recovery—interrupted updates can brick the device if no secondary recovery mechanism (e.g., UART boot) is implemented.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
ATSAMR21G18A-MFT CAD Models
Microchip Technology ATSAMR21G18A-MFT PCB symbols & footprints
productDetail
