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ATSAMA5D36A-CUR
Microchip Technology
IC MPU SAMA5D3 536MHZ 324LFBGA
1000454 Pcs New Original In Stock
ARM® Cortex®-A5 Microprocessor IC SAMA5D3 1 Core, 32-Bit 536MHz 324-LFBGA (15x15)
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5.0 / 5.0
- (119 Ratings)
ATSAMA5D36A-CUR
Product Overview
1256498
DiGi Electronics Part Number
ATSAMA5D36A-CUR-DGManufacturer
Microchip Technology
ATSAMA5D36A-CUR
Description
IC MPU SAMA5D3 536MHZ 324LFBGAInventory
1000454 Pcs New Original In Stock
ARM® Cortex®-A5 Microprocessor IC SAMA5D3 1 Core, 32-Bit 536MHz 324-LFBGA (15x15)
Quantity
Minimum 1
Minimum 1
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ATSAMA5D36A-CUR Technical Specifications
Category
Embedded, Microprocessors
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SAMA5D3
Product Status
Active
Core Processor
ARM® Cortex®-A5
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
536MHz
Co-Processors/DSP
-
RAM Controllers
LPDDR, LPDDR2, DDR2
Graphics Acceleration
No
Display & Interface Controllers
LCD, Touchscreen
Ethernet
10/100/1000Mbps (1)
SATA
-
USB
USB 2.0 (3)
Voltage - I/O
1.2V, 1.8V, 3.3V
Operating Temperature
-40°C ~ 85°C (TA)
Security Features
AES, SHA, TDES, TRNG
Mounting Type
Surface Mount
Package / Case
324-LFBGA
Supplier Device Package
324-LFBGA (15x15)
Additional Interfaces
CAN, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART
Base Product Number
ATSAMA5
Datasheet & Documents
HTML Datasheet
ATSAMA5D36A-CUR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
ATSAMA5D36A-CURTR
ATSAMA5D36A-CURCT
ATSAMA5D36A-CURDKR
Standard Package
500
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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de desembre 02, 2025
The quality assurance from DiGi Electronics gives me peace of mind with every purchase.
de desembre 02, 2025
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de desembre 02, 2025
Their customer service staff was very personable and made the process enjoyable.
de desembre 02, 2025
I appreciate their proactive communication and speedy delivery for urgent orders.
de desembre 02, 2025
DiGi Electronics excels in ensuring that shipment dispatches are punctual.
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Frequently Asked Questions (FAQ)
What are the key thermal and power design considerations when integrating the ATSAMA5D36A-CUR into a compact industrial enclosure with limited airflow?
The ATSAMA5D36A-CUR, operating at 536MHz in a 324-LFBGA package, can dissipate up to 1.2W under typical load, requiring careful thermal management—especially in sealed or high-ambient-temperature environments. Due to its MSL 3 rating, proper reflow profiling is essential to avoid moisture-induced delamination. Designers should use a grounded thermal pad on the PCB with multiple vias to a dedicated ground plane and consider a small heatsink or thermal interface material if junction temperatures approach 100°C. Always validate thermal performance under worst-case workload (e.g., sustained CPU + Ethernet + LCD activity) using IR imaging or embedded temperature sensors, as passive cooling may be insufficient without airflow.
Can the ATSAMA5D36A-CUR reliably replace the NXP i.MX6UL in a cost-sensitive HMI application, and what software or hardware risks should I evaluate?
While the ATSAMA5D36A-CUR offers a lower-cost BOM and integrated Gigabit Ethernet (vs. 10/100 on i.MX6UL), direct replacement requires significant evaluation. The Cortex-A5 core is less performant than the i.MX6UL’s Cortex-A7, especially in floating-point workloads, which may affect GUI rendering or control algorithms. Additionally, the ATSAMA5D36A-CUR lacks a GPU, so complex graphics must rely on software rendering—impacting frame rates. Boot configuration differs (ROM code vs. i.MX boot pins), and Linux BSP support, while available from Microchip, may lag in community-driven features. Validate real-time responsiveness, display pipeline latency, and long-term driver support before committing to redesign.
How does the memory subsystem of the ATSAMA5D36A-CUR impact real-time performance in motor control applications using CAN and PWM?
The ATSAMA5D36A-CUR supports LPDDR, LPDDR2, and DDR2, but shared memory bandwidth between the CPU, DMA, and peripherals (like CAN and LCD controllers) can introduce latency spikes during high-throughput scenarios. In motor control systems where deterministic response is critical, avoid heavy LCD updates or Ethernet traffic during PWM generation cycles. Use tightly coupled memory (TCM) for time-sensitive ISRs if available in your RTOS configuration, and prioritize CAN message handling via interrupt nesting. Also, ensure DDR timings are optimized during boot—poorly tuned memory controllers can add jitter, degrading control loop stability.
What reliability risks should I consider when deploying the ATSAMA5D36A-CUR in outdoor telecommunications equipment exposed to -40°C to 85°C cycling?
Although the ATSAMA5D36A-CUR is rated for -40°C to 85°C (TA), prolonged thermal cycling in outdoor enclosures can stress the 324-LFBGA solder joints, especially if the PCB has mismatched CTE (coefficient of thermal expansion). Use SAC305 or higher-reliability solder and consider underfill for high-vibration environments. The internal TRNG and crypto accelerators (AES/SHA) are useful for secure boot in remote deployments, but ensure firmware includes watchdog supervision and brown-out detection, as voltage droops during cold starts can corrupt execution. Additionally, verify that all external components (e.g., DDR, oscillators) share the same industrial temp range—system reliability depends on the weakest link.
Is the ATSAMA5D36A-CUR suitable for battery-powered edge devices requiring long sleep-mode operation, and how do I minimize leakage current?
The ATSAMA5D36A-CUR is not optimized for ultra-low-power sleep modes compared to Cortex-M based MPUs, but it can be used in intermittently active edge devices with careful power gating. In standby, the core can draw >10mA unless peripheral clocks are fully disabled and I/Os are configured to avoid floating states. To minimize leakage: disable unused interfaces (e.g., SATA, USB PHYs), set GPIOs to known states, and use external power switches to cut power to DDR and peripherals during deep sleep. Leverage the internal RTC for wake-up timers instead of running the main oscillator. Expect total system sleep current in the 5–20mA range—significantly higher than Cortex-M0+ alternatives like the SAM L10—so evaluate duty-cycle requirements carefully to meet battery life targets.
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ATSAMA5D36A-CUR CAD Models
Microchip Technology ATSAMA5D36A-CUR PCB symbols & footprints
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