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ATSAMA5D33A-CU
Microchip Technology
IC MPU SAMA5D3 536MHZ 324LFBGA
1841 Pcs New Original In Stock
ARM® Cortex®-A5 Microprocessor IC SAMA5D3 1 Core, 32-Bit 536MHz 324-LFBGA (15x15)
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5.0 / 5.0
- (490 Ratings)
ATSAMA5D33A-CU
Product Overview
1301625
DiGi Electronics Part Number
ATSAMA5D33A-CU-DGManufacturer
Microchip Technology
ATSAMA5D33A-CU
Description
IC MPU SAMA5D3 536MHZ 324LFBGAInventory
1841 Pcs New Original In Stock
ARM® Cortex®-A5 Microprocessor IC SAMA5D3 1 Core, 32-Bit 536MHz 324-LFBGA (15x15)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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ATSAMA5D33A-CU Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
SAMA5D3
Product Status
Active
Core Processor
ARM® Cortex®-A5
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
536MHz
Co-Processors/DSP
-
RAM Controllers
LPDDR, LPDDR2, DDR2
Graphics Acceleration
No
Display & Interface Controllers
LCD, Touchscreen
Ethernet
10/100/1000Mbps (1)
SATA
-
USB
USB 2.0 (3)
Voltage - I/O
1.2V, 1.8V, 3.3V
Operating Temperature
-40°C ~ 85°C (TA)
Security Features
AES, SHA, TDES, TRNG
Mounting Type
Surface Mount
Package / Case
324-LFBGA
Supplier Device Package
324-LFBGA (15x15)
Additional Interfaces
I2C, SPI, SSC, USART
Base Product Number
ATSAMA5
Datasheet & Documents
HTML Datasheet
ATSAMA5D33A-CU-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
ATSAMA5D33ACU
Standard Package
126
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Les délais de livraison sont toujours respectés, ce qui est essentiel pour la gestion de nos projets.
de desembre 02, 2025
Die Produkte bei DiGi Electronics sind langlebig und hochwertig, und der Versand war supereilig.
de desembre 02, 2025
DiGi Electronics makes it easy to monitor shipments with their reliable tracking system.
de desembre 02, 2025
We've built a strong partnership with DiGi Electronics thanks to their unwavering commitment to reliability.
de desembre 02, 2025
The clarity of their prices and product standards makes shopping a breeze.
de desembre 02, 2025
DiGi Electronics has earned my trust through their excellent quality and service.
de desembre 02, 2025
I’m always impressed by how quickly orders arrive at great prices from DiGi Electronics.
de desembre 02, 2025
Their consistent on-time delivery helps me coordinate complex manufacturing schedules.
de desembre 02, 2025
They prioritize customer satisfaction through quick support and delivery.
de desembre 02, 2025
Received my order rapidly, and the support team was fantastic.
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Frequently Asked Questions (FAQ)
What are the key considerations when replacing the NXP i.MX35 with the ATSAMA5D33A-CU in an industrial HMI design?
When replacing the NXP i.MX35 with the ATSAMA5D33A-CU, engineers must evaluate the lack of integrated graphics acceleration in the ATSAMA5D33A-CU, which may require external display drivers or FPGA support for complex GUIs. Additionally, verify that the 536MHz Cortex-A5 core meets real-time response requirements, as the i.MX35 has higher DSP throughput. Ensure compatibility with DDR2/LPDDR memory interfaces and confirm that USB 2.0 and Ethernet 10/100/1000 support in the ATSAMA5D33A-CU align with peripheral connectivity needs. Finally, revalidate boot configuration options and security features such as AES and TRNG, which can enhance system integrity over the older i.MX35 platform.
How does the ATSAMA5D33A-CU handle mixed-voltage interface design with legacy 3.3V and modern 1.8V peripherals?
The ATSAMA5D33A-CU supports multiple I/O voltages—1.2V, 1.8V, and 3.3V—enabling direct interfacing with both legacy 3.3V and low-power 1.8V peripherals without level shifters in many cases. However, engineers must route VDDIO domains carefully in PCB layout to avoid noise coupling, especially when mixing high-speed signals like LCD or Ethernet. Use separate power rails with filtering for each VDDIO group and confirm pin muxing compatibility, as not all pins support 3.3V tolerance when configured for high-speed functions such as USB or EMAC. This mixed-voltage flexibility reduces BOM cost but requires thorough power sequencing alignment with datasheet recommendations.
Can the ATSAMA5D33A-CU reliably operate in harsh industrial environments at 85°C ambient temperature, and what thermal management strategies are recommended?
Yes, the ATSAMA5D33A-CU is rated for operation up to 85°C ambient (TA), but sustained performance in harsh environments requires proper thermal design. The 324-LFBGA (15x15mm) package includes a thermal pad that must be soldered to a ground plane with multiple thermal vias to maximize heat dissipation. Simulate worst-case power consumption based on clock speed and peripheral usage, and consider adding a heatsink or forced airflow if junction temperature exceeds 100°C. Also, monitor long-term reliability risks such as electromigration under high thermal cycling conditions typical in industrial automation, and ensure conformal coating is used in high-humidity installations.
What are the design-in risks when using the ATSAMA5D33A-CU in a new IoT gateway compared to the STMicroelectronics STM32MP157A?
Compared to the STM32MP157A, the ATSAMA5D33A-CU lacks a second Cortex-A5 or M4 coprocessor, limiting real-time control capabilities critical in IoT gateways managing both high-level networking and sensor preprocessing. This means additional external MCUs or firmware partitioning may be needed for low-latency tasks, increasing complexity. Also, the STM32MP157A offers better power efficiency and more advanced graphics support, whereas the ATSAMA5D33A-CU relies on basic LCD interface only. However, the ATSAMA5D33A-CU provides strong security features—AES, SHA, TDES, TRNG—that are advantageous for secure edge communication, so evaluate whether security needs outweigh multimedia and power trade-offs.
How can engineers mitigate reliability risks during reflow soldering of the ATSAMA5D33A-CU given its MSL3 rating and 324-LFBGA package?
To mitigate reliability risks during reflow, strictly adhere to the MSL3 requirement by baking the ATSAMA5D33A-CU if exposed to ambient conditions beyond 168 hours at >60% RH—typically 120°C for 10 hours pre-reflow. Use a controlled reflow profile matching J-STD-020, focusing on peak temperature (260°C max) and ramp rates to avoid solder ball cracking or warpage in the 324-LFBGA package. Implement X-ray inspection post-assembly to detect hidden voids or misalignment. Additionally, ensure PCB pad layout follows IPC-7351 guidelines and include fiducials for precise placement, minimizing field failures due to mechanical stress or open circuits.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
ATSAMA5D33A-CU CAD Models
Microchip Technology ATSAMA5D33A-CU PCB symbols & footprints
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