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ATSAMA5D27C-D1G-CUR
Microchip Technology
IC MPU SAMA5D2 500MHZ 289TFBGA
2186 Pcs New Original In Stock
ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 289-TFBGA (14x14)
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5.0 / 5.0
- (384 Ratings)
ATSAMA5D27C-D1G-CUR
Product Overview
1285544
DiGi Electronics Part Number
ATSAMA5D27C-D1G-CUR-DGManufacturer
Microchip Technology
ATSAMA5D27C-D1G-CUR
Description
IC MPU SAMA5D2 500MHZ 289TFBGAInventory
2186 Pcs New Original In Stock
ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 289-TFBGA (14x14)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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365 - Day Quality Guarantee - Every part fully backed.
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Worldwide Delivery in 3-5 Business Days
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ATSAMA5D27C-D1G-CUR Technical Specifications
Category
Embedded, Microprocessors
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SAMA5D2
Product Status
Active
Core Processor
ARM® Cortex®-A5
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
500MHz
Co-Processors/DSP
Multimedia; NEON™ MPE
RAM Controllers
LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration
Yes
Display & Interface Controllers
Keyboard, LCD, Touchscreen
Ethernet
10/100Mbps (1)
SATA
-
USB
USB 2.0 + HSIC
Voltage - I/O
3.3V
Operating Temperature
-40°C ~ 85°C (TA)
Security Features
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type
Surface Mount
Package / Case
289-TFBGA
Supplier Device Package
289-TFBGA (14x14)
Additional Interfaces
I2C, SMC, SPI, UART, USART, QSPI
Base Product Number
ATSAMA5
Datasheet & Documents
HTML Datasheet
ATSAMA5D27C-D1G-CUR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
150-ATSAMA5D27C-D1G-CURDKR
150-ATSAMA5D27C-D1G-CURCT
150-ATSAMA5D27C-D1G-CURTR
ATSAMA5D27C-D1G-CUR-DG
Standard Package
1,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
La transparence des prix chez DiGi Electronics est remarquable. Cela facilite grandement mes décisions d'achat.
de desembre 02, 2025
Delivery was exceptionally quick, and the packaging was both neat and secure.
de desembre 02, 2025
I appreciate how seamlessly their support team helps me troubleshoot and optimize my projects.
de desembre 02, 2025
The quality of their electronic accessories is consistently high, with no defects or issues.
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Frequently Asked Questions (FAQ)
Can the ATSAMA5D27C-D1G-CUR reliably replace a NXP i.MX6UL in an industrial HMI design without requiring major firmware or power architecture changes?
The ATSAMA5D27C-D1G-CUR can serve as a functional replacement for the NXP i.MX6UL in HMI applications, but significant firmware and power design adjustments are typically required. While both are 32-bit ARM Cortex-A5 MPUs with similar clock speeds (~500–696 MHz), the ATSAMA5D27C-D1G-CUR lacks the i.MX6UL’s advanced power gating and dynamic voltage scaling, which may increase idle power consumption in battery-backed or low-power modes. Additionally, the ATSAMA5D27C-D1G-CUR uses a 289-TFBGA package with different pinout and peripheral mapping (e.g., QSPI vs. EIM), requiring PCB layout changes. Boot configuration also differs—Microchip relies on ROM code with boot from QSPI/SD, whereas i.MX6UL supports more flexible boot sources. Firmware must be rewritten using Atmel Software Framework or Linux BSP from Microchip, as U-Boot and kernel drivers are not directly compatible.
What are the key reliability risks when using the ATSAMA5D27C-D1G-CUR in outdoor industrial equipment operating near its -40°C to 85°C temperature limit?
Operating the ATSAMA5D27C-D1G-CUR near its -40°C or 85°C limits introduces reliability risks related to timing margin degradation, solder joint fatigue, and flash memory retention. At temperature extremes, internal PLL jitter increases, which may cause intermittent failures in high-speed interfaces like DDR3L or USB HSIC if PCB trace lengths are not tightly matched. The 289-TFBGA package is susceptible to thermal cycling stress; without proper underfill or conformal coating, solder joints may crack over time. Additionally, the internal QSPI flash controller and external flash devices may exhibit reduced data retention at 85°C, especially if write cycles are frequent. To mitigate, derate the CPU frequency slightly under thermal stress, use industrial-grade external memory, implement thermal monitoring via the internal temperature sensor, and ensure adequate airflow or heatsinking in sealed enclosures.
How does the ATSAMA5D27C-D1G-CUR compare to the STM32MP157F in terms of real-time performance and secure boot implementation for a medical device requiring functional safety?
The ATSAMA5D27C-D1G-CUR and STM32MP157F both feature Cortex-A5 cores, but they differ significantly in real-time and security capabilities. The ATSAMA5D27C-D1G-CUR includes a dedicated Real-Time Interrupt Controller (RTIC) and secure boot with hardware-enforced root-of-trust via Secure Fusebox and ARM TrustZone, making it better suited for high-assurance medical applications requiring tamper-resistant firmware validation. In contrast, the STM32MP157F relies more on software-based secure boot and lacks a dedicated RTIC, though it offers tighter integration with Cortex-M4 for deterministic real-time tasks. For medical devices, the ATSAMA5D27C-D1G-CUR’s hardware crypto accelerators (AES, SHA, TRNG) and secure JTAG disablement provide stronger compliance with IEC 62304 security requirements. However, the STM32MP157F may offer easier dual-core (A7+M4) task partitioning for mixed criticality workloads.
What PCB layout challenges should I anticipate when designing with the ATSAMA5D27C-D1G-CUR’s 289-TFBGA package, especially for DDR3L and QSPI interfaces?
Designing with the ATSAMA5D27C-D1G-CUR’s 289-TFBGA (14x14 mm) package demands careful attention to high-speed signal integrity and power delivery. The DDR3L interface requires tightly controlled impedance (50Ω single-ended, 100Ω differential), length-matched traces (±50 mil tolerance), and a solid ground plane beneath the memory bus to minimize crosstalk and EMI. The QSPI interface, often used for boot flash, should be routed as short, shielded traces with series termination to prevent overshoot. Due to the fine 0.5 mm ball pitch, via-in-pad or microvias are recommended to escape inner layers, and a 4-layer minimum PCB with dedicated power/ground planes is essential. Additionally, the MSL3 rating means the device must be mounted within 168 hours of opening the dry pack; otherwise, baking is required to prevent moisture-induced delamination during reflow.
Is it safe to run the ATSAMA5D27C-D1G-CUR at 500 MHz continuously in a sealed enclosure with no active cooling, and what thermal design margins should I include?
Running the ATSAMA5D27C-D1G-CUR at full 500 MHz in a sealed enclosure is feasible but requires conservative thermal design to avoid junction temperature exceeding 105°C, which can accelerate electromigration and reduce long-term reliability. Even though the ambient rating is 85°C, the die temperature can rise 20–30°C above ambient under load due to power dissipation (typically 1.2–1.8W depending on peripherals). Use a thermal model or IR imaging to validate hotspots, and ensure the PCB has sufficient copper pour connected to the package thermal pad (via multiple vias) to act as a heat spreader. Include a 15°C safety margin below the max junction temperature, and consider throttling CPU frequency or disabling unused peripherals (e.g., LCD controller) during sustained loads. For mission-critical applications, integrate the internal temperature sensor with a watchdog or thermal shutdown routine in software.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
ATSAMA5D27C-D1G-CUR CAD Models
Microchip Technology ATSAMA5D27C-D1G-CUR PCB symbols & footprints
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