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ATSAM4E8CA-CU
Microchip Technology
IC MCU 32BIT 512KB FLSH 100TFBGA
3440 Pcs New Original In Stock
ARM® Cortex®-M4 SAM4E Microcontroller IC 32-Bit Single-Core 120MHz 512KB (512K x 8) FLASH 100-TFBGA (9x9)
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5.0 / 5.0
- (146 Ratings)
ATSAM4E8CA-CU
Product Overview
1259414
DiGi Electronics Part Number
ATSAM4E8CA-CU-DGManufacturer
Microchip Technology
ATSAM4E8CA-CU
Description
IC MCU 32BIT 512KB FLSH 100TFBGAInventory
3440 Pcs New Original In Stock
ARM® Cortex®-M4 SAM4E Microcontroller IC 32-Bit Single-Core 120MHz 512KB (512K x 8) FLASH 100-TFBGA (9x9)
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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ATSAM4E8CA-CU Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
SAM4E
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
ARM® Cortex®-M4
Core Size
32-Bit Single-Core
Speed
120MHz
Connectivity
CANbus, Ethernet, IrDA, MMC/SD, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
79
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
128K x 8
Voltage - Supply (Vcc/Vdd)
1.62V ~ 3.6V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
100-TFBGA (9x9)
Package / Case
100-TFBGA
Base Product Number
ATSAM4E
Datasheet & Documents
HTML Datasheet
ATSAM4E8CA-CU-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
1611-ATSAM4E8CA-CU
Standard Package
260
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Expédition rapide comme l’éclair et support client au top, merci!
de desembre 02, 2025
手頃な価格で、高品質なサービスを受けられて良かったです。
de desembre 02, 2025
配送の際の梱包が非常に丈夫で、商品の傷や破損が一切ありませんでした。
de desembre 02, 2025
I appreciate how swiftly they process my orders, even during busy times.
de desembre 02, 2025
The after-sales support provided by DiGi Electronics is outstanding, ensuring peace of mind for all customers.
de desembre 02, 2025
Their professional attitude reassures me that I am choosing the best for my DIY needs.
de desembre 02, 2025
Their prices are very competitive, and the shopping process is straightforward.
de desembre 02, 2025
The durability and reliability of DiGi Electronics' offerings are truly commendable.
de desembre 02, 2025
DiGi Electronics’ after-sales service is outstanding; they follow up promptly to ensure our satisfaction and help us optimize the product performance.
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Frequently Asked Questions (FAQ)
Can the ATSAM4E8CA-CU be safely used in a 3.3V industrial control system with 5V-tolerant inputs from legacy sensors, and what are the risks if I connect 5V signals directly to its GPIO pins?
The ATSAM4E8CA-CU is not 5V-tolerant on its I/O pins, despite operating at 3.3V (1.62V–3.6V Vcc). Applying 5V signals directly to any GPIO can cause latch-up, long-term degradation, or immediate failure due to exceeding the absolute maximum ratings. To interface with 5V legacy sensors, use level-shifting circuitry such as TXB0108 or discrete MOSFET-based shifters. Alternatively, select a microcontroller with true 5V-tolerant I/O, like the ATSAM4S16CB-AU, if redesign flexibility exists. Always verify signal integrity and ensure transient overvoltage protection is in place to mitigate field failure risks.
What are the key differences between the ATSAM4E8CA-CU and its substitute ATSAM4E8CB-CN, and can I drop in the CB-CN version without firmware or PCB changes in my existing design?
While the ATSAM4E8CB-CN is listed as a substitute for the ATSAM4E8CA-CU, the primary difference lies in packaging: the CA-CU uses a 100-TFBGA (9x9mm) tray package, while the CB-CN uses a 100-TFBGA (12x12mm) tray with a different ball map. This means the CB-CN is not a drop-in replacement—PCB layout changes are required due to the larger footprint and altered pinout. Additionally, the CB-CN may have slightly different power sequencing requirements. Always cross-check the latest datasheets and consider thermal and mechanical constraints. For new designs, prefer the CA-CU unless the larger package offers better thermal performance in high-current applications.
How reliable is the internal oscillator of the ATSAM4E8CA-CU for Ethernet communication in a noisy factory environment, and should I use an external crystal for IEEE 1588 time synchronization?
The ATSAM4E8CA-CU’s internal RC oscillator (±1% accuracy) is insufficient for precise Ethernet timing, especially when implementing IEEE 1588 Precision Time Protocol (PTP) in industrial automation. In electrically noisy environments, clock drift can cause packet loss, synchronization errors, and network instability. For reliable Ethernet operation—particularly with real-time protocols—use a high-stability external 25MHz crystal (e.g., ECS-250-8-30B-CGN) with low ESR and proper load capacitors. This improves timing accuracy to ±50 ppm or better, reducing jitter and ensuring compliance with industrial Ethernet standards. Always include a π-filter on the crystal supply if power noise is a concern.
Is the ATSAM4E8CA-CU suitable for battery-powered IoT edge devices requiring long sleep-mode operation, and how does its power consumption compare to the newer ATSAML21J18B?
The ATSAM4E8CA-CU is not ideal for ultra-low-power battery applications. In backup mode, it draws ~1.5µA, but active-mode current at 120MHz exceeds 50mA—significantly higher than the ATSAML21J18B, which consumes <35µA/MHz in active mode and 0.6µA in deep sleep with RTC. If your design requires multi-year battery life, consider migrating to the SAM L21 series. However, if your application demands high-performance processing (e.g., real-time signal analysis) and power budget allows periodic recharging, the ATSAM4E8CA-CU remains viable. Optimize power by disabling unused peripherals, using DMA to minimize CPU wake time, and leveraging its sleepwalking peripherals for event-driven wake-up.
What are the thermal and layout risks when mounting the ATSAM4E8CA-CU on a 4-layer PCB without a thermal pad, and how can I prevent overheating during sustained CAN and Ethernet traffic?
The ATSAM4E8CA-CU in a 100-TFBGA package lacks an exposed thermal pad, making heat dissipation challenging under high load (e.g., simultaneous CAN FD and Ethernet traffic). Without proper thermal management, junction temperatures can exceed 100°C, triggering thermal throttling or long-term reliability issues. To mitigate this, use a 4-layer PCB with solid ground planes on inner layers connected to the MCU’s GND balls via multiple vias. Add thermal vias under high-power areas and ensure adequate copper pour on top and bottom layers. Monitor temperature in-field using the internal temperature sensor and consider airflow or heatsinking if ambient temperatures approach 70°C. For continuous high-throughput applications, evaluate the ATSAM4E8EA-AU (LQFP package) for better thermal performance.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
ATSAM4E8CA-CU CAD Models
Microchip Technology ATSAM4E8CA-CU PCB symbols & footprints
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