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ATSAM3S2AA-AU
Microchip Technology
IC MCU 32BIT 128KB FLASH 48LQFP
1783 Pcs New Original In Stock
ARM® Cortex®-M3 SAM3S Microcontroller IC 32-Bit Single-Core 64MHz 128KB (128K x 8) FLASH 48-LQFP (7x7)
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5.0 / 5.0
- (484 Ratings)
ATSAM3S2AA-AU
Product Overview
1446932
DiGi Electronics Part Number
ATSAM3S2AA-AU-DGManufacturer
Microchip Technology
ATSAM3S2AA-AU
Description
IC MCU 32BIT 128KB FLASH 48LQFPInventory
1783 Pcs New Original In Stock
ARM® Cortex®-M3 SAM3S Microcontroller IC 32-Bit Single-Core 64MHz 128KB (128K x 8) FLASH 48-LQFP (7x7)
Quantity
Minimum 1
Minimum 1
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ATSAM3S2AA-AU Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
SAM3S
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
ARM® Cortex®-M3
Core Size
32-Bit Single-Core
Speed
64MHz
Connectivity
I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O
34
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
32K x 8
Voltage - Supply (Vcc/Vdd)
1.62V ~ 3.6V
Data Converters
A/D 8x10/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
48-LQFP (7x7)
Package / Case
48-LQFP
Base Product Number
ATSAM3S
Datasheet & Documents
HTML Datasheet
ATSAM3S2AA-AU-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
ATSAM3S2AAAU
Standard Package
250
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
가격이 저렴하면서도 언제나 친절하게 응답해주셔서 매우 만족스럽습니다.
de desembre 02, 2025
スピーディな対応と優れた品質に感謝しています。今後も利用します！
de desembre 02, 2025
Quick delivery and outstanding support make DiGi Electronics stand out.
de desembre 02, 2025
They maintain excellent communication and support even after the purchase.
de desembre 02, 2025
Their responsive after-sales team helped me resolve issues quickly and efficiently.
de desembre 02, 2025
They prioritize quick delivery, ensuring I receive my products without delay.
de desembre 02, 2025
Impressed by how quickly my order was shipped out. It made my shopping experience very satisfying.
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Frequently Asked Questions (FAQ)
Can the ATSAM3S2AA-AU replace an STM32F103C8T6 in a 3.3V industrial sensor node without firmware rewrites, given both use ARM Cortex-M3 cores?
While the ATSAM3S2AA-AU and STM32F103C8T6 share the same ARM Cortex-M3 architecture, direct replacement is not recommended without firmware modifications. The ATSAM3S2AA-AU has different memory map organization, peripheral register layouts (especially for USB and ADC), and clocking architecture. For example, the SAM3S uses a more complex PMC (Power Management Controller) for clock gating compared to STM32’s simpler RCC. Additionally, the ATSAM3S2AA-AU lacks built-in EEPROM emulation support that many STM32F1 designs rely on via flash sectors. A pin-to-pin compatible drop-in replacement is unlikely due to differing I/O counts and package pinouts—verify your specific board layout before attempting substitution.
What are the key reliability risks when operating the ATSAM3S2AA-AU at 3.6V near its upper Vdd limit in a high-temperature environment (70°C+)?
Operating the ATSAM3S2AA-AU at 3.6V near 85°C ambient increases risk of accelerated electromigration and reduced long-term reliability due to combined thermal and voltage stress. Although within datasheet limits, sustained operation at this corner condition can degrade flash memory retention and increase leakage current in I/O buffers. Microchip recommends derating supply voltage to ≤3.3V when operating above 70°C to mitigate these effects. Also, ensure proper decoupling (100nF + 10µF per power pin) and avoid simultaneous switching of multiple high-current I/Os, which can cause localized voltage droop and brown-out resets—especially critical since the internal BOD may not react fast enough to transient dips.
How does the ATSAM3S2AA-AU’s USB 2.0 Full-Speed interface compare to the NXP LPC1768 for embedded HID applications, and what design trade-offs should I consider?
The ATSAM3S2AA-AU integrates a USB 2.0 Full-Speed device controller with built-in transceiver, eliminating the need for external PHY—unlike the LPC1768, which requires an external USB transceiver for most designs. This simplifies BOM and layout for the ATSAM3S2AA-AU. However, the SAM3S has stricter timing requirements for USB suspend/resume and lacks the LPC1768’s larger FIFO buffers, making it less ideal for high-throughput bulk transfers. For low-bandwidth HID devices (e.g., keyboards, sensors), the ATSAM3S2AA-AU is sufficient and more cost-effective. But if you anticipate future firmware upgrades over USB or need low-power suspend modes with fast wake-up, the LPC1768’s more mature USB stack and lower suspend current may justify its added complexity.
Is it safe to use the internal oscillator of the ATSAM3S2AA-AU for precision timing in a motor control application requiring ±1% clock accuracy over temperature?
No—the internal RC oscillator in the ATSAM3S2AA-AU typically has ±3% to ±5% initial accuracy and drifts further over temperature (-40°C to 85°C), making it unsuitable for motor control requiring ±1% timing precision. For reliable PWM generation and encoder feedback timing, use an external 12 MHz crystal with load capacitors matched to the crystal’s specifications. The SAM3S supports this via its XIN/XOUT pins and includes automatic clock failure detection. Relying on the internal oscillator may cause step loss in stepper motors or instability in closed-loop BLDC control due to jitter and drift, especially under thermal cycling.
What precautions are needed when replacing a failed ATSAM3S2AA-AU in a field-deployed 48-LQFP board, considering MSL 3 and reflow constraints?
Since the ATSAM3S2AA-AU is rated MSL 3 (168 hours floor life), any replacement unit must be baked at 125°C for 24 hours if it has exceeded its exposure time after opening the dry pack. During rework, use a controlled reflow profile with peak temperature ≤260°C and time above liquidus (TAL) limited to 60 seconds to prevent delamination or bond wire damage. Avoid hot-air rework without proper nozzle sizing—the 7x7mm 48-LQFP is prone to tombstoning if heat is uneven. Always verify post-replacement functionality with a known-good firmware image and check for latent failures using Microchip’s SAM-BA bootloader to validate flash integrity. Keep spare units in moisture barrier bags with desiccant to prevent future field failures.
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ATSAM3S2AA-AU CAD Models
Microchip Technology ATSAM3S2AA-AU PCB symbols & footprints
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