AT49LV040-90TC >
AT49LV040-90TC
Microchip Technology
IC FLASH 4MBIT PARALLEL 32TSOP
1479 Pcs New Original In Stock
FLASH Memory IC 4Mbit Parallel 90 ns 32-TSOP
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AT49LV040-90TC Microchip Technology
5.0 / 5.0 - (159 Ratings)

AT49LV040-90TC

Product Overview

1294507

DiGi Electronics Part Number

AT49LV040-90TC-DG
AT49LV040-90TC

Description

IC FLASH 4MBIT PARALLEL 32TSOP

Inventory

1479 Pcs New Original In Stock
FLASH Memory IC 4Mbit Parallel 90 ns 32-TSOP
Memory
Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 1.8036 1.8036
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AT49LV040-90TC Technical Specifications

Category Memory, Memory

Manufacturer Microchip Technology

Packaging -

Series -

Product Status Obsolete

DiGi-Electronics Programmable Not Verified

Memory Type Non-Volatile

Memory Format FLASH

Technology FLASH

Memory Size 4Mbit

Memory Organization 512K x 8

Memory Interface Parallel

Write Cycle Time - Word, Page 50µs

Access Time 90 ns

Voltage - Supply 3V ~ 3.6V

Operating Temperature 0°C ~ 70°C (TC)

Mounting Type Surface Mount

Package / Case 32-TFSOP (0.724", 18.40mm Width)

Supplier Device Package 32-TSOP

Base Product Number AT49LV040

Datasheet & Documents

HTML Datasheet

AT49LV040-90TC-DG

Environmental & Export Classification

RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071

Additional Information

Standard Package
156

Reviews

5.0/5.0-(Show up to 5 Ratings)
Bai***Doux
de desembre 02, 2025
5.0
Je recommande vivement DiGi Electronics pour leur livraison express et leurs emballages robustes. C'est toujours un plaisir de commander chez eux.
Gedank***lieger
de desembre 02, 2025
5.0
Schnelle Lieferung und dauerhafte Qualität – so funktioniert Einkauf bei DiGi Electronics.
Wor***lle
de desembre 02, 2025
5.0
Ich fühle mich bei DiGi Electronics rundum gut betreut, die Qualität ihrer Produkte ist beeindruckend.
Lumin***Lakes
de desembre 02, 2025
5.0
The packaging quality shows they truly care about the customer experience.
Morn***Glow
de desembre 02, 2025
5.0
This company's prices are some of the most attractive I've encountered in the electronics sector.
Sea***eze
de desembre 02, 2025
5.0
They consistently provide excellent support after sales, making my experience positive.
Hope***loom
de desembre 02, 2025
5.0
Quick dispatch and lightning-fast customer support—highly satisfied.
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Frequently Asked Questions (FAQ)

The AT49LV040-90TC is obsolete and runs on 3.3V. What are the specific risks of using it in a new 5V-tolerant legacy system, and is there a direct drop-in replacement from Microchip with a similar TSOP-32 footprint?

The primary risk is I/O overstress. Although the AT49LV040-90TC operates at 3.0V–3.6V, if your legacy system uses 5V logic levels without proper level shifting, the input buffers may experience latch-up or long-term degradation, especially during extended write cycles. There is no direct drop-in replacement from Microchip with the same TSOP-32 pinout and 3.3V-only operation that is not obsolete. For new designs, consider the SST39SF040 series (5V) if your system voltage allows, but this requires a voltage regulator change. For a true 3.3V replacement, you would need to adapt to a different form factor like the SST39LF040 in PLCC or adjust the PCB for a newer 3.3V parallel flash, as the TSOP-32 footprint for 4Mbit 3.3V flashes is largely deprecated.

I am replacing an AM29F040B in a 32-pin TSOP layout with the AT49LV040-90TC. Besides the voltage difference (5V vs 3.3V), what subtle timing or command sequence mismatches could cause intermittent write failures?

While both are 4Mbit parallel flashes, the AT49LV040-90TC uses a different software command algorithm. The AMD AM29F040B typically uses the JEDEC standard algorithm with specific 'Unlock Bypass' commands, whereas the AT49LV040 uses a simpler two-cycle write sequence for byte programming but requires strict adherence to the 'Chip Erase' command pattern (AA, 55, 80, AA, 55, 10) which differs slightly in timing expectations. Intermittent failures often arise from the Write Cycle Time (tWC). The AT49LV040-90TC specifies a minimum byte write time of 50µs (typical), but if your controller is using the 35µs timing optimized for the AMD part, you will see data corruption. Implement a software polling loop (checking DQ7 or DQ6 toggling) instead of fixed delays to ensure robust integration.

For a battery-powered handheld device operating near the 0°C low end, does the AT49LV040-90TC exhibit longer access times or higher write current spikes that could cause brownout conditions during firmware updates?

Yes, thermal constraints are critical. While the AT49LV040-90TC is rated for 90ns access time at 70°C, at 0°C the access time may degrade slightly, though typically still within margin if your system uses a 120ns or slower memory cycle. The greater risk is during the 50µs write cycle. The peak current during a write operation can spike to 15mA–20mA, which is higher than the read current. In a battery-powered system near 0°C, battery internal impedance increases, making it susceptible to brownouts during firmware updates. To mitigate, use a low-ESR capacitor (≥10µF) placed directly across the VCC and VSS pins of the AT49LV040-90TC, and sequence any power-hungry peripherals to idle mode before initiating a write cycle.

The AT49LV040-90TC is in a 32-TSOP package with RoHS non-compliant status. For high-reliability industrial applications requiring leaded finish, what are the solder joint reliability risks during thermal cycling if I use this obsolete part?

Since the AT49LV040-90TC is non-RoHS (contains lead in the terminals), it actually provides superior solder joint reliability for industrial or harsh environments compared to SAC305 (lead-free) alloys, as it is less prone to tin whiskers and offers better ductility under thermal stress. However, the risk comes from the package's Moisture Sensitivity Level (MSL 3) and the part's obsolete status. If this component has been in storage for extended periods, it must be baked per J-STD-033 before reflow to prevent popcorning. For high-reliability designs, the real risk is the supply chain; obtaining a consistent lot code is difficult, and mixing lot codes from different procurement sources can lead to variances in the lead finish quality and internal die bond integrity, increasing failure rates in thermal cycling tests.

We are using the AT49LV040-90TC to store FPGA configuration bitstreams. Considering its 90ns access time, how do I calculate the maximum safe system clock frequency for the FPGA loading process to avoid setup time violations?

To avoid setup time violations, you must account for the full asynchronous read cycle. The AT49LV040-90TC specifies an address access time (tACC) of 90ns maximum and an output enable access time (tOE) of 40ns typical. When calculating the FPGA loading clock, use the worst-case tACC. If your FPGA uses a clocked configuration interface where the flash address is toggled on the rising edge and data is latched on the next rising edge, the minimum clock period must be > tACC (90ns) plus the FPGA setup time (typically 5–10ns) plus board trace delay. This yields a safe maximum frequency of approximately 10 MHz. To improve reliability, do not rely solely on the 90ns limit; add a 20% timing margin by limiting the configuration clock to ≤8 MHz and ensure the FPGA's configuration controller inserts one wait state to accommodate the flash memory's address hold time requirements after the read cycle.

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