25LC256T-E/SN >
25LC256T-E/SN
Microchip Technology
IC EEPROM 256KBIT SPI 8SOIC
3279 Pcs New Original In Stock
EEPROM Memory IC 256Kbit SPI 10 MHz 8-SOIC
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25LC256T-E/SN Microchip Technology
5.0 / 5.0 - (379 Ratings)

25LC256T-E/SN

Product Overview

1240709

DiGi Electronics Part Number

25LC256T-E/SN-DG
25LC256T-E/SN

Description

IC EEPROM 256KBIT SPI 8SOIC

Inventory

3279 Pcs New Original In Stock
EEPROM Memory IC 256Kbit SPI 10 MHz 8-SOIC
Memory
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 2.5175 2.5175
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25LC256T-E/SN Technical Specifications

Category Memory, Memory

Manufacturer Microchip Technology

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

DiGi-Electronics Programmable Verified

Memory Type Non-Volatile

Memory Format EEPROM

Technology EEPROM

Memory Size 256Kbit

Memory Organization 32K x 8

Memory Interface SPI

Clock Frequency 10 MHz

Write Cycle Time - Word, Page 5ms

Voltage - Supply 2.5V ~ 5.5V

Operating Temperature -40°C ~ 125°C (TA)

Mounting Type Surface Mount

Package / Case 8-SOIC (0.154", 3.90mm Width)

Supplier Device Package 8-SOIC

Base Product Number 25LC256

Datasheet & Documents

HTML Datasheet

25LC256T-E/SN-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0051

Additional Information

Other Names
25LC256T-E/SNDKR
25LC256T-E/SNCT
25LC256T-E/SN-DG
25LC256T-E/SNTR
Standard Package
3,300

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M95256-WMW6TG-DG
0.0252
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Reviews

5.0/5.0-(Show up to 5 Ratings)
Galaxie***encieuse
de desembre 02, 2025
5.0
La rapidité de traitement des commandes est vraiment remarquable, je suis très satisfait.
Gold***eadow
de desembre 02, 2025
5.0
The commitment to customer satisfaction is evident in their logistics and support services.
Starb***tPath
de desembre 02, 2025
5.0
Their support staff is friendly, professional, and very responsive.
Mo***low
de desembre 02, 2025
5.0
Their logistics tracking dashboard is user-friendly and very informative.
Lush***izons
de desembre 02, 2025
5.0
Their commitment to excellent after-sales service makes me confident in my purchases.
Fre***tart
de desembre 02, 2025
5.0
The packaging integrity of DiGi Electronics’ shipments always exceeds my expectations.
Drea***aver
de desembre 02, 2025
5.0
Their equipment’s robustness exceeds my expectations, making it a trustworthy choice for continuous use.
Sun***Gaze
de desembre 02, 2025
5.0
The combination of rapid shipping and careful packaging makes this retailer stand out.
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Frequently Asked Questions (FAQ)

What are the key design-in risks when using the 25LC256T-E/SN in a high-temperature industrial application near 125°C?

When integrating the 25LC256T-E/SN in high-temperature environments close to its 125°C maximum rating, engineers must account for potential timing degradation and increased bit error rates. Ensure SPI signal integrity with proper trace termination and minimize noise coupling. Also, validate write cycle timing margins, as propagation delays can increase at temperature extremes. Confirm adequate PCB thermal dissipation, especially in enclosed spaces, and consider derating the endurance specification (typically 1M write cycles) by up to 50% to maintain reliability over the product lifecycle under sustained elevated temperatures.

How does the 25LC256T-E/SN compare to the M95256-DRDW3TP/MICRO and whether it's a viable drop-in replacement?

The 25LC256T-E/SN and M95256-DRDW3TP/MICRO both offer 256Kbit SPI EEPROM in 8-SOIC packages, but key differences affect drop-in replacement feasibility. The 25LC256T-E/SN supports a wider voltage range (2.5V–5.5V) vs. M95256’s 2.5V–5.5V (same range), but clock frequency matches at 10 MHz. Pin compatibility is confirmed—both are standard SPI with identical pinouts. However, the M95256 has a shorter write cycle time (3.5ms vs. 5ms), which may affect performance-critical applications. Replace cautiously: verify firmware timing delays for write completion and confirm compatibility with hold/write-protect features if used.

What PCB layout considerations are critical when designing the 25LC256T-E/SN into a noise-sensitive mixed-signal system?

For reliable operation of the 25LC256T-E/SN in mixed-signal designs, minimize SPI signal ringing and reduce ground bounce. Use controlled trace lengths for SCK, SI, and SO lines, ideally under 10 cm, and route them away from high-speed digital or switching power traces. Include a solid ground plane beneath the 25LC256T-E/SN, and place a 100nF ceramic capacitor as close as possible to VCC and GND pins. Use series resistors (22–47Ω) on SPI lines if ringing occurs. Also, ensure the HOLD pin is tied properly (to VCC or MCU control) to avoid unintended suspend modes during SPI contention.

Can the 25LC256T-E/SN be used safely in automotive under-the-hood applications given its -40°C to 125°C rating?

While the 25LC256T-E/SN specifies an operating temperature range of -40°C to 125°C, it is not qualified to AEC-Q100 standards, making it unsuitable for automotive safety or critical under-the-hood systems. The junction temperature in enclosed engine compartments may exceed 125°C without proper thermal management. Even if ambient is within range, self-heating during write cycles (which draw higher current) can push the device beyond limits. For automotive applications, consider the 25LC256-HI/SM or AEC-Q100-compliant alternatives. Use the 25LC256T-E/SN only in benign or non-safety automotive zones with active thermal monitoring.

What are the reliability risks when frequently updating data in the 25LC256T-E/SN, and how can wear leveling be implemented effectively?

The 25LC256T-E/SN specifies a write endurance of 1 million cycles per byte, but frequent writes to the same memory location can lead to premature failure. To mitigate wear, implement software-based wear leveling: distribute write operations across multiple addresses instead of overwriting a single location. For example, cycle through a block of 32 addresses to log sensor data rather than rewriting one. Also, minimize write operations by buffering changes and using the 64-byte page write capability efficiently to reduce individual write cycles. Pair with a CRC or checksum to detect corruption, especially in high-reliability systems where long-term data integrity is critical.

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