1210B473K501NT >
1210B473K501NT
Knowles Novacap
CAP CER 0.047UF 500V X7R 1210
2343 Pcs New Original In Stock
0.047 µF ±10% 500V Ceramic Capacitor X7R 1210 (3225 Metric)
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1210B473K501NT Knowles Novacap
5.0 / 5.0 - (277 Ratings)

1210B473K501NT

Product Overview

1228475

DiGi Electronics Part Number

1210B473K501NT-DG

Manufacturer

Knowles Novacap
1210B473K501NT

Description

CAP CER 0.047UF 500V X7R 1210

Inventory

2343 Pcs New Original In Stock
0.047 µF ±10% 500V Ceramic Capacitor X7R 1210 (3225 Metric)
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Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 0.0755 0.0755
  • 10 0.0604 0.6040
  • 30 0.0529 1.5870
  • 100 0.0472 4.7200
  • 500 0.0427 21.3500
  • 1000 0.0404 40.4000
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1210B473K501NT Technical Specifications

Category Ceramic Capacitors

Manufacturer Knowles Precision

Packaging Cut Tape (CT)

Series -

Product Status Active

Capacitance 0.047 µF

Tolerance ±10%

Voltage - Rated 500V

Temperature Coefficient X7R

Operating Temperature -55°C ~ 125°C

Features -

Ratings -

Applications General Purpose

Failure Rate -

Mounting Type Surface Mount, MLCC

Package / Case 1210 (3225 Metric)

Size / Dimension 0.125" L x 0.100" W (3.18mm x 2.54mm)

Height - Seated (Max) -

Thickness (Max) 0.065" (1.65mm)

Lead Spacing -

Lead Style -

Base Product Number 1210B

Datasheet & Documents

HTML Datasheet

1210B473K501NT-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Affected
ECCN EAR99
HTSUS 8532.24.0020

Additional Information

Other Names
1763-1114-1
1763-1114-2
1763-1114-6
Standard Package
2,000

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
C1210C473M1RAC7800
KEMET
1107
C1210C473M1RAC7800-DG
0.0404
Upgrade
CC1210KKX7R0BB473
YAGEO
1090
CC1210KKX7R0BB473-DG
0.0404
Upgrade
C3225CH2E473K250AA
TDK Corporation
960
C3225CH2E473K250AA-DG
0.0404
MFR Recommended
1210J5000473MXT
Knowles Syfer
1204
1210J5000473MXT-DG
0.0404
Upgrade
KGM32ER72D473MU
KYOCERA AVX
1155
KGM32ER72D473MU-DG
0.0404
Upgrade

Reviews

5.0/5.0-(Show up to 5 Ratings)
Sonn***lume
de desembre 02, 2025
5.0
Die professionelle Verpackung sorgt dafür, dass alles in perfektem Zustand bei mir ankommt.
Natu***ktar
de desembre 02, 2025
5.0
Ich schätze die prompte Kommunikation nach dem Kauf, die mein Vertrauen in DiGi Electronics gestärkt hat.
星***やき
de desembre 02, 2025
5.0
アフターサービスの対応が素早く、安心して利用できる企業です。価格も非常に良心的です。
PureL***tPath
de desembre 02, 2025
5.0
The logistics tracking system provided by DiGi Electronics is incredibly reliable and transparent.
Dre***uest
de desembre 02, 2025
5.0
I highly recommend their services for their excellent customer care and logistics efficiency.
Joyfu***rizon
de desembre 02, 2025
5.0
I highly recommend DiGi Electronics for their outstanding customer service and product dependability.
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Frequently Asked Questions (FAQ)

What are the key reliability risks when using the 1210B473K501NT in high-voltage switching applications above 300V, and how can I mitigate them?

The 1210B473K501NT, rated at 500V, may experience accelerated aging or microcracking under sustained high-voltage stress—especially in hard-switching topologies like flyback or buck converters—due to piezoelectric effects inherent in X7R dielectrics. To mitigate risk, derate the voltage by at least 20% (i.e., operate below 400V), ensure PCB layout avoids mechanical stress near the capacitor, and consider adding snubber circuits to reduce voltage spikes. Also, verify thermal management, as self-heating under ripple current can compound dielectric degradation over time.

Can I replace the 1210B473K501NT with a C1210C473KBRAC7800 in a 48V-to-12V DC-DC converter without redesigning the board?

While the C1210C473KBRAC7800 (Kemet) shares similar electrical specs—0.047µF, 500V, X7R, 1210 package—it has a different thickness (1.60mm vs. 1.65mm max for the 1210B473K501NT) and may exhibit slightly higher ESR and lower ripple current capability. Direct drop-in replacement is mechanically feasible, but in high-frequency converters, the difference in parasitic inductance and loss tangent could affect efficiency and stability. Validate performance under full load and transient conditions; if phase margin or output noise degrades, consider tuning compensation or reverting to the original part.

How does the 1210B473K501NT behave under temperature cycling in automotive under-hood environments, and what derating is recommended?

The 1210B473K501NT’s X7R dielectric provides stable capacitance from -55°C to 125°C (±15% variation), but repeated thermal cycling in automotive environments (e.g., -40°C to 125°C daily) can induce mechanical fatigue at the solder joints due to CTE mismatch. To enhance reliability, apply a 30% voltage derating (use below 350V), use SAC305 or higher-reliability solder, and avoid placing the capacitor near heat sources or on flexible sections of the PCB. Consider conformal coating to reduce moisture-induced delamination during thermal shocks.

Is the 1210B473K501NT suitable for snubber circuits in 400V AC line filtering, and how does its aging compare to C0G alternatives?

The 1210B473K501NT can be used in 400V AC snubber applications, but X7R dielectrics exhibit significant capacitance drift over time—up to 2–5% per decade hour—due to ferroelectric domain relaxation, unlike stable C0G types. This aging reduces effective snubbing performance over years of operation. For long-term stability in critical EMI filtering, consider C0G/NP0 alternatives (e.g., 1210C102K1GACTU), though they offer lower capacitance density. If using the 1210B473K501NT, oversize the initial capacitance by 20% to compensate for aging and monitor in-field performance.

What PCB layout practices should I follow when placing the 1210B473K501NT near high-current traces to avoid mechanical failure?

The 1210B473K501NT is susceptible to flex cracking if mounted near high-current traces that cause localized board bending during thermal cycling. Maintain a minimum 2mm clearance from thick copper pours or bus bars, and orient the capacitor perpendicular to expected board flexure direction. Use symmetrical pad designs with non-solder-mask-defined (NSMD) pads to improve solder joint robustness. Additionally, avoid placing vias directly under the component, as they can create stress concentrators. These practices reduce the risk of latent field failures due to mechanical fatigue in vibration-prone or thermally cycled systems.

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