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S25FL256LAGNFV010
Infineon Technologies
IC FLASH 256MBIT SPI/QUAD 8WSON
18190 Pcs New Original In Stock
FLASH - NOR Memory IC 256Mbit SPI - Quad I/O, QPI 133 MHz 8-WSON (6x8)
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5.0 / 5.0
- (222 Ratings)
S25FL256LAGNFV010
Product Overview
6317077
DiGi Electronics Part Number
S25FL256LAGNFV010-DGManufacturer
Infineon Technologies
S25FL256LAGNFV010
Description
IC FLASH 256MBIT SPI/QUAD 8WSONInventory
18190 Pcs New Original In Stock
FLASH - NOR Memory IC 256Mbit SPI - Quad I/O, QPI 133 MHz 8-WSON (6x8)
Quantity
Minimum 1
Minimum 1
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S25FL256LAGNFV010 Technical Specifications
Category
Memory, Memory
Packaging
Tray
Series
FL-L
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Memory Type
Non-Volatile
Memory Format
FLASH
Technology
FLASH - NOR
Memory Size
256Mbit
Memory Organization
32M x 8
Memory Interface
SPI - Quad I/O, QPI
Clock Frequency
133 MHz
Write Cycle Time - Word, Page
-
Voltage - Supply
2.7V ~ 3.6V
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
8-WDFN Exposed Pad
Supplier Device Package
8-WSON (6x8)
Base Product Number
S25FL256
Datasheet & Documents
HTML Datasheet
S25FL256LAGNFV010-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991B1A
HTSUS
8542.32.0071
Additional Information
Other Names
428-4096-DG
SP005661293
448-S25FL256LAGNFV010
428-4096
Standard Package
338
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
配送スタッフが礼儀正しく、気持ちよく商品を受け取ることができました。
de desembre 02, 2025
初めての利用でも迷うことなく商品ページにたどり着けましたし、購入もスムーズにできました。
de desembre 02, 2025
The customer response team was attentive and provided detailed assistance after my purchase.
de desembre 02, 2025
They are transparent about costs and support, making the entire process trustworthy.
de desembre 02, 2025
I trust DiGi Electronics for reliable and durable products that never compromise on quality.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the S25FL256LAGNFV010 in a high-temperature industrial application near 105°C?
When designing the S25FL256LAGNFV010 into high-temperature environments near its 105°C operating limit, thermal stress can affect long-term data retention and endurance. Ensure proper PCB thermal relief and avoid prolonged exposure to elevated temperatures during write/erase cycles, as the specified endurance (typically 100K cycles) may degrade faster at elevated temperatures. Use thermal vias under the exposed pad to improve heat dissipation and validate actual die temperature—not just ambient—during operation to maintain reliability over time in industrial control or outdoor applications.
How does the S25FL256LAGNFV010 compare to the Winbond W25Q256JV in terms of SPI timing compatibility and firmware portability?
The S25FL256LAGNFV010 and Winbond W25Q256JV both support Quad SPI and QPI modes at up to 133 MHz, but firmware porting requires caution. While command sets are broadly similar, subtle differences exist in reset timing, write enable behavior, and status register layouts. The S25FL256LAGNFV010 uses Infineon's FL-L family protocol with slightly different timing for QPI entry and exit sequences. Validate timing margins on CS# deassertion and use proper dummy cycles in read instructions when switching from Winbond parts to avoid timing violations or bus contention during legacy code migration.
Can the S25FL256LAGNFV010 replace the Macronix MX25L25645G in a space-constrained automotive design, and what are the package integration challenges?
Yes, the S25FL256LAGNFV010 can replace the MX25L25645G in automotive applications due to matching 256Mbit density, SPI/QPI support, and -40°C to 105°C operation, but the 8-WSON (6x8 mm) package requires accurate land pattern design. Unlike standard SOIC or larger packages, the 8-WSON has a small footprint with an exposed thermal pad—improper solder stencil or reflow profiling may lead to voiding or thermal detachment. Use the manufacturer's recommended footprint, confirm alignment with IPC-7351, and inspect via X-ray to ensure solder joint integrity in high-vibration environments.
What are the implications of the S25FL256LAGNFV010's 133 MHz QPI mode on signal integrity in a noisy embedded system?
Operating the S25FL256LAGNFV010 in 133 MHz QPI mode demands careful PCB layout to maintain signal integrity. At high frequencies, trace length mismatch, lack of controlled impedance, or insufficient return paths can cause timing skew or data corruption. Keep SPI bus traces under 50 mm, use continuous ground planes beneath signal layers, and avoid routing near switching power supplies. Terminate signals with series resistors (10–33 Ω) close to the driver if ringing is observed. For robust operation, consider falling back to standard SPI mode in electrically noisy environments where EMI cannot be fully controlled.
What reliability concerns should be addressed when using the S25FL256LAGNFV010 in a mission-critical system with frequent firmware updates?
Frequent firmware updates with the S25FL256LAGNFV010 risk exceeding its specified program/erase endurance (typically 100,000 cycles per sector), potentially leading to bit errors or sector lock-up. Implement wear-leveling algorithms even in simple boot managers to distribute erase cycles across sectors. Additionally, power-loss during write operations may corrupt data—use voltage supervisors or supercapacitor hold-up circuits to ensure safe completion of critical writes. Monitor block health via ECC feedback if supported, and validate recovery paths during unexpected resets.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
S25FL256LAGNFV010 CAD Models
Infineon Technologies S25FL256LAGNFV010 PCB symbols & footprints
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