IRAMS06UP60B >
IRAMS06UP60B
Infineon Technologies
PWR MOD 600V 6A 23PWRSIP
1294 Pcs New Original In Stock
Power Driver Module IGBT 3 Phase 600 V 6 A 23-PowerSIP Module, 19 Leads, Formed Leads
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IRAMS06UP60B Infineon Technologies
5.0 / 5.0 - (70 Ratings)

IRAMS06UP60B

Product Overview

6925813

DiGi Electronics Part Number

IRAMS06UP60B-DG
IRAMS06UP60B

Description

PWR MOD 600V 6A 23PWRSIP

Inventory

1294 Pcs New Original In Stock
Power Driver Module IGBT 3 Phase 600 V 6 A 23-PowerSIP Module, 19 Leads, Formed Leads
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 12.0240 12.0240
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IRAMS06UP60B Technical Specifications

Category Power Driver Modules

Manufacturer Infineon Technologies

Packaging -

Series iMOTION™

Product Status Obsolete

Type IGBT

Configuration 3 Phase

Current 6 A

Voltage 600 V

Voltage - Isolation 2000Vrms

Mounting Type Through Hole

Package / Case 23-PowerSIP Module, 19 Leads, Formed Leads

Datasheet & Documents

HTML Datasheet

IRAMS06UP60B-DG

Environmental & Export Classification

Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
SP001536848
*IRAMS06UP60B
Standard Package
80

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
STK541UC62K-E
onsemi
1454
STK541UC62K-E-DG
11.5614
MFR Recommended

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5.0/5.0-(Show up to 5 Ratings)
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de desembre 02, 2025
5.0
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)

Can IRAMS06UP60B be used as a drop-in replacement for STK541UC62K-E in a 3-phase motor inverter design, and what are the key compatibility risks?

The IRAMS06UP60B can serve as a functional alternative to the STK541UC62K-E in low-power 3-phase inverter applications, but it is not a direct pin-to-pin or control-compatible drop-in replacement. Key differences include gate drive requirements—IRAMS06UP60B integrates a driver optimized for 15 V gate drive with under-voltage lockout (UVLO), while the STK541UC62K-E may have different turn-on thresholds and bootstrap diode characteristics. Additionally, thermal performance and isolation ratings differ; IRAMS06UP60B offers 2000Vrms isolation, which improves safety margin, but PCB layout must be redesigned due to the 23-PowerSIP form factor with formed leads. Always verify gate drive timing, dead-time requirements, and heat dissipation in your existing enclosure when transitioning from STK541UC62K-E to IRAMS06UP60B to avoid shoot-through or thermal runaway risks.

Is the IRAMS06UP60B suitable for industrial motor drives operating in high-temperature environments, and how should thermal derating be handled?

The IRAMS06UP60B is suitable for industrial motor drives but requires cautious thermal management above 75°C ambient. With a 6 A rated current, conduction and switching losses increase significantly at higher junction temperatures, especially in hard-switched topologies. To ensure reliability, derate current by at least 40% at 100°C ambient, use a heatsink with thermal resistance ≤2°C/W, and ensure proper airflow. Monitor TJ during transient loads—sustained operation above 140°C risks long-term degradation of internal bond wires and reduced lifetime. Implement an NTC thermistor near the module if thermal shutdown is not already in your control loop.

What are the critical PCB layout considerations when integrating the IRAMS06UP60B in a through-hole mounted inverter stage?

When laying out the IRAMS06UP60B in a through-hole design, minimize high dv/dt loop areas by placing DC-link capacitors as close as possible to the module’s V+ and GND terminals. Use wide, short traces for power paths and separate power ground from signal ground, connecting them at a single star point near the control IC. The formed leads of the 23-PowerSIP package create mechanical stress risks—ensure proper support to prevent solder joint cracking, especially in vibration-prone environments. Also, maintain ≥8 mm creepage/clearance distances for 600 V isolation, and avoid placing sensitive signal traces under the module to prevent EMI coupling.

How does the obsolescence status of IRAMS06UP60B impact long-term design-in decisions for new production systems?

The obsolescence status of the IRAMS06UP60B means Infineon no longer manufactures it, relying on existing inventory (currently 1217 pcs). For new designs or long-run production, this creates supply chain risk; future availability is not guaranteed. If designing with IRAMS06UP60B, secure lifetime buys and validate pin-compatible alternatives like the newer iMOTION™ IM828 or external driver + discrete IGBT solutions. Consider redesigning for surface-mount modules or scalable gate drivers to improve long-term serviceability. Avoid IRAMS06UP60B in products with >3-year market life unless end-of-life stockpiling is planned.

What are the reliability risks of using IRAMS06UP60B in hard-switching applications with inductive loads, and how can they be mitigated?

In hard-switching inductive load applications, the IRAMS06UP60B faces reliability risks from voltage overshoot during IGBT turn-off, especially with high dI/dt. The 600 V rating leaves limited margin if unclamped inductive spikes exceed 650 V. To mitigate, always include RC snubbers across each phase leg or use clamping diodes. Ensure fast-recovery freewheeling diodes are adequately rated, and avoid high stray inductance in power loops. Additionally, verify short-circuit ruggedness—while the internal IGBT is designed for brief faults, repeated events degrade the device. Implement feedforward current limiting or desaturation detection in the control loop to protect the IRAMS06UP60B during overload or stall conditions.

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