TCP0J226M8R >
TCP0J226M8R
KYOCERA AVX
P- CASE / 226- CAP CODE / MN02
1526 Pcs New Original In Stock
22 µF Molded Tantalum Capacitors 6.3 V 0805 (2012 Metric)
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TCP0J226M8R KYOCERA AVX
5.0 / 5.0 - (113 Ratings)

TCP0J226M8R

Product Overview

1977010

DiGi Electronics Part Number

TCP0J226M8R-DG

Manufacturer

KYOCERA AVX
TCP0J226M8R

Description

P- CASE / 226- CAP CODE / MN02

Inventory

1526 Pcs New Original In Stock
22 µF Molded Tantalum Capacitors 6.3 V 0805 (2012 Metric)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 3000 0.1243 372.8835
  • 6000 0.1140 684.1380
  • 9000 0.1111 999.9225
  • 15000 0.1080 1619.5260
  • 30000 0.1037 3112.4520
  • 75000 0.0999 7492.7100
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TCP0J226M8R Technical Specifications

Category Tantalum Capacitors

Manufacturer KYOCERA AVX

Packaging Tape & Reel (TR)

Series TC

Product Status Active

Capacitance 22 µF

Tolerance ±20%

Voltage - Rated 6.3 V

Type Molded

ESR (Equivalent Series Resistance) -

Operating Temperature -55°C ~ 125°C

Lifetime @ Temp. -

Mounting Type Surface Mount

Package / Case 0805 (2012 Metric)

Size / Dimension 0.079" L x 0.049" W (2.00mm x 1.25mm)

Height - Seated (Max) 0.047" (1.20mm)

Lead Spacing -

Manufacturer Size Code P

Ratings -

Features General Purpose

Failure Rate -

Datasheet & Documents

HTML Datasheet

TCP0J226M8R-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.21.0050

Additional Information

Other Names
478-TCP0J226M8RCT
478-TCP0J226M8RDKR
478-TCP0J226M8RTR
Standard Package
3,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
心***者
de desembre 02, 2025
5.0
購物流程流暢,客服熱心,整體非常滿意。
Rêv***Chic
de desembre 02, 2025
5.0
Je suis impressionné par leur engagement envers la satisfaction du client et la qualité de leurs produits.
よ***笑顔
de desembre 02, 2025
5.0
コストパフォーマンスが良く、透明な料金体系に信頼を寄せています。サポートも充実しています。
Bree***aven
de desembre 02, 2025
5.0
Their after-sales support demonstrates genuine care for their customers.
Crys***Clear
de desembre 02, 2025
5.0
Their affordability helps me expand my collection without breaking the bank.
Crys***Mist
de desembre 02, 2025
5.0
The professionalism and speed of their support make a big difference.
Encha***dNest
de desembre 02, 2025
5.0
The combination of professional service and secure packaging sets them apart.
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)

What are the key design risks when using the TCP0J226M8R in a high-temperature SMT assembly process, and how can I prevent thermal damage during reflow?

The TCP0J226M8R is rated for operation up to 125°C and has an MSL-1 rating (unlimited floor life), making it robust for standard SMT assembly. However, due to its molded tantalum construction, excessive peak reflow temperatures—especially beyond 260°C—can risk internal delamination or dielectric stress. To mitigate this, ensure your reflow profile adheres to JEDEC J-STD-020, with peak temperature ≤260°C for ≤20 seconds. Avoid repeated thermal cycling, and consider thermal profiling of the 0805 footprint to prevent thermal gradients that may crack the capacitor body during cooling. Verify board flex during pick-and-place to avoid mechanical stress on the TCP0J226M8R, particularly in high-vibration environments post-assembly.

How does the TCP0J226M8R compare to the GRM32DR71E226KA12K in terms of suitability for space-constrained power rail decoupling in portable devices?

The TCP0J226M8R (22µF, 6.3V, 0805 molded tantalum) offers higher volumetric efficiency than the GRM32DR71E226KA12K (22µF, 25V, 1210 multilayer ceramic), allowing for smaller footprint in power rail decoupling where voltage stress is low. However, the ceramic GRM32DR71E226KA12K has near-zero ESR and no risk of catastrophic failure due to surge current, while the TCP0J226M8R requires current-limiting design due to tantalum’s vulnerability to thermal runaway. Use the TCP0J226M8R only if board space is critical and the input voltage stays below 5V (ideally ≤50% derating to 3.15V), with soft-start circuitry. For higher reliability in uncontrolled environments, the ceramic alternative is preferred despite larger size.

Can I safely replace a suspected counterfeit KEMET T491C226M006ATE050 with the authentic TCP0J226M8R in an existing medical device design?

Yes, the TCP0J226M8R is a suitable replacement for the KEMET T491C226M006ATE050 (both 22µF, 6.3V, 0805 molded tantalum), but critical design-in checks are required. Confirm voltage derating—apply no more than 50% of rated voltage (≤3.15V) per medical reliability standards. The TCP0J226M8R has similar dimensions and termination, but verify solder pad layout compatibility to avoid thermal imbalance during reflow. Unlike KEMET’s rated failure level (L0), KYOCERA AVX does not specify failure rate for this series, so conduct extended burn-in testing at 125°C with operational bias to screen for infant mortality. Ensure full traceability and RoHS/REACH compliance documentation for regulatory audits in medical applications.

What are the reliability implications of using the TCP0J226M8R without voltage derating in a 5V always-on power domain?

Operating the TCP0J226M8R near its 6.3V rated voltage (e.g., 5V rails) without sufficient derating significantly increases the risk of field failure due to crystallization-induced short circuits in the manganese dioxide electrolyte. Industry best practice recommends at least 50% voltage derating for molded tantalum capacitors—limiting use to ≤3.15V for the TCP0J226M8R. In a 5V always-on domain, this creates an unacceptable stress condition that may lead to thermal runaway, especially under transient load spikes. To safely use TCP0J226M8R, either step down the rail to 3.3V or select a 10V-rated tantalum (e.g., TCP0K226M8R) or switch to a high-capacitance ceramic alternative with sufficient DC bias margin.

How does the physical construction of the TCP0J226M8R affect its vulnerability to mechanical stress cracking during board flex or thermal cycling?

The TCP0J226M8R’s molded phenolic resin case offers better mechanical protection than chip tantalums with epoxy-only coatings, but its molded body is still brittle compared to flex-terminated MLCCs. In applications with frequent board flex (e.g., handheld devices, connectors), the rigid 0805 package can transfer stress to solder joints and internal dielectric, increasing crack risk. Mitigate this by mounting the TCP0J226M8R perpendicular to expected flex axes, using adhesive underfill for bulk capacitance sections, and avoiding placement near board edges or tall components. Additionally, limit thermal cycling depth and rate during environmental testing to avoid cumulative fatigue in the MnO2 cathode system.

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