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LTC2335HLX-18#PBF
Analog Devices Inc.
IC ADC 18BIT SAR 48LQFP
17638 Pcs New Original In Stock
18 Bit Analog to Digital Converter 8 Input 1 SAR 48-LQFP (7x7)
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5.0 / 5.0
- (107 Ratings)
LTC2335HLX-18#PBF
Product Overview
8172283
DiGi Electronics Part Number
LTC2335HLX-18#PBF-DGManufacturer
Analog Devices Inc.
LTC2335HLX-18#PBF
Description
IC ADC 18BIT SAR 48LQFPInventory
17638 Pcs New Original In Stock
18 Bit Analog to Digital Converter 8 Input 1 SAR 48-LQFP (7x7)
Quantity
Minimum 1
Minimum 1
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LTC2335HLX-18#PBF Technical Specifications
Category
Data Acquisition, Analog to Digital Converters (ADC)
Packaging
Tray
Series
SoftSpan™
Product Status
Active
Number of Bits
18
Sampling Rate (Per Second)
1M
Number of Inputs
8
Input Type
Differential
Data Interface
LVDS - Serial, SPI
Configuration
MUX-S/H-ADC
Ratio - S/H:ADC
1:1
Number of A/D Converters
1
Architecture
SAR
Reference Type
External, Internal
Voltage - Supply, Analog
5V
Voltage - Supply, Digital
5V
Features
-
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Supplier Device Package
48-LQFP (7x7)
Mounting Type
Surface Mount
Base Product Number
LTC2335
Datasheet & Documents
HTML Datasheet
LTC2335HLX-18#PBF-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
LTC2335HLX-18#PBFTR-DG
LTC2335HLX-18#PBFCT
LTC2335HLX-18#PBFDKR
LTC2335HLX-18#PBFDKRINACTIVE
LTC2335HLX-18#PBFCTINACTIVE
LTC2335HLX-18#PBFDKR-DG
505-LTC2335HLX-18#PBF
2166-LTC2335HLX-18#PBF-505
LTC2335HLX-18#PBFCT-DG
LTC2335HLX-18#PBF-DG
LTC2335HLX-18#PBFTR
-2735-LTC2335HLX-18#PBF
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
パッケージの開封時に、きちんとした整理と丁寧さに感心しました。
de desembre 02, 2025
物流のシステムが非常に効率的で、待たされることなく商品が到着しました。
de desembre 02, 2025
Delivery was swift, and I commend the eco packaging for its minimal environmental impact.
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Frequently Asked Questions (FAQ)
When migrating from an older system using a similar SAR ADC, what are the potential integration challenges when replacing it with the Analog Devices LTC2335HLX-18#PBF, especially concerning its SoftSpan™ inputs?
The Analog Devices LTC2335HLX-18#PBF features SoftSpan™ inputs, which offer flexible input ranges that can be programmed. When replacing an older ADC, ensure your input signal conditioning circuitry is compatible with these programmable ranges. Verify that the voltage levels and impedance of your existing drivers can effectively interface with the LTC2335HLX-18#PBF's input configuration, as improper matching could lead to reduced accuracy or even damage. Consider a test design phase to validate the signal integrity and gain/offset adjustments required for optimal performance with the LTC2335HLX-18#PBF.
For high-accuracy industrial automation applications, how can I mitigate the risk of noise coupling into the Analog Devices LTC2335HLX-18#PBF's 8 differential inputs when sharing a PCB with noisy power switching components?
To mitigate noise coupling into the 8 differential inputs of the Analog Devices LTC2335HLX-18#PBF, implement robust PCB layout practices. This includes dedicating separate ground planes for analog and digital sections, routing differential signal pairs closely together with controlled impedance, and using guard traces around sensitive input lines. Furthermore, consider placing ferrite beads or small filter capacitors at the input pins of the LTC2335HLX-18#PBF to attenuate high-frequency noise. Thorough signal integrity simulations are recommended to identify and address potential coupling issues before assembly.
What are the key design trade-offs when selecting between the Analog Devices LTC2335HLX-18#PBF and a competitor part like the Texas Instruments ADS8881ISBG#PBF for a battery-powered sensor node that requires 18-bit resolution and low power consumption?
When comparing the Analog Devices LTC2335HLX-18#PBF to the Texas Instruments ADS8881ISBG#PBF for a battery-powered application, consider the power consumption profiles of each. While both offer 18-bit resolution, the LTC2335HLX-18#PBF's SoftSpan™ inputs might offer greater flexibility in driving them directly from various sensors, potentially reducing the need for external gain stages and their associated power draw. However, carefully analyze the active and sleep current specifications of both ADCs in your target operating modes. The ADS8881ISBG#PBF might have a more optimized power profile for certain scenarios, making it a crucial factor in battery life optimization. Also, evaluate the ease of interface and required support circuitry for each device to minimize overall system power.
Under what operating conditions might the Analog Devices LTC2335HLX-18#PBF's 1M sample/second conversion rate introduce latency issues in a real-time closed-loop control system, and what are the mitigation strategies?
The 1M sample/second rate of the Analog Devices LTC2335HLX-18#PBF can introduce latency in real-time closed-loop control systems, primarily due to the digital interface (SPI or LVDS) and the processing time required by the microcontroller. If your control loop requires sub-millisecond response times, the combined conversion time, data transfer, and processing delay might be too long. Mitigation strategies include using the faster LVDS interface if supported by your microcontroller, optimizing your control algorithm for faster execution, and potentially employing a parallel processing approach or a dedicated DSP to handle critical control tasks. Also, consider if a lower sampling rate on the LTC2335HLX-18#PBF can still meet your system's bandwidth requirements while reducing latency.
What are the critical considerations for ensuring long-term reliability and preventing premature failure of the Analog Devices LTC2335HLX-18#PBF in a high-temperature, high-vibration industrial environment, beyond standard component handling?
Ensuring long-term reliability for the Analog Devices LTC2335HLX-18#PBF in harsh industrial environments involves careful attention to several factors. Thermal management is paramount; ensure adequate heatsinking and airflow around the 48-LQFP package to keep junction temperatures well within the -40°C to 125°C operating range, especially under sustained high sampling rates. Vibration can stress solder joints, so robust PCB design with appropriate component placement and conformal coating for protection against environmental contaminants is advisable. Furthermore, review the power supply filtering and decoupling strategy for the LTC2335HLX-18#PBF to prevent voltage transients that could degrade performance or cause early failure. Regular system health monitoring and periodic recalibration can also help detect early signs of degradation.
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LTC2335HLX-18#PBF CAD Models
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