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12402032E202A
Amphenol ICC (Commercial Products)
USB3.2 GEN1, TYPE C, VERTICAL, D
1449 Pcs New Original In Stock
USB-C (USB TYPE-C) USB 3.2 Gen 1 (USB 3.1 Gen 1, Superspeed (USB 3.0)) Receptacle Connector 24 Position Surface Mount, Through Hole
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*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (300 Ratings)
12402032E202A
Product Overview
9604227
DiGi Electronics Part Number
12402032E202A-DGManufacturer
Amphenol ICC (Commercial Products)
12402032E202A
Description
USB3.2 GEN1, TYPE C, VERTICAL, DInventory
1449 Pcs New Original In Stock
USB-C (USB TYPE-C) USB 3.2 Gen 1 (USB 3.1 Gen 1, Superspeed (USB 3.0)) Receptacle Connector 24 Position Surface Mount, Through Hole
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
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12402032E202A Technical Specifications
Category
USB, DVI, HDMI Connectors, USB, DVI, HDMI Connector Assemblies
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Connector Type
USB-C (USB TYPE-C)
Number of Contacts
24
Gender
Receptacle
Specifications
USB 3.2 Gen 1 (USB 3.1 Gen 1, Superspeed (USB 3.0))
Mounting Type
Surface Mount, Through Hole
Mounting Feature
Vertical
Termination
Solder
Features
Board Guide
Ingress Protection
-
Number of Ports
1
Current Rating (Amps)
5A
Voltage - Rated
-
Mating Cycles
10000
Shielding
Shielded
Contact Finish
Gold
Shell/Shielding Material
Steel, Stainless
Material Flammability Rating
-
Insulation Color
Black
Base Product Number
1240203
Datasheet & Documents
HTML Datasheet
12402032E202A-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Additional Information
Other Names
664-12402032E202ACT
664-12402032E202ATR
Standard Package
800
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
처음 이용했는데 고객 서비스가 훌륭했고, 배송도 신속했어요. 강력히 추천합니다.
de desembre 02, 2025
사후 서비스가 이렇게 꼼꼼하게 진행되다니 놀라웠어요. 오래 유지보수까지 책임지는 모습이 인상적입니다.
de desembre 02, 2025
Die pünktliche Zustellung macht den Bestellprozess bei DiGi Electronics sehr angenehm, die Qualität der Produkte ist stets überzeugend.
de desembre 02, 2025
Die Produkte sind sehr hochwertig verarbeitet, und der Versand verlief super schnell, alles perfekt.
de desembre 02, 2025
My orders always arrive early or on time, and the packaging is excellent to prevent any damage.
de desembre 02, 2025
The team's professionalism in support matters is outstanding.
de desembre 02, 2025
Fast delivery combined with supportive customer care made my experience excellent.
de desembre 02, 2025
The logistics tracking system is seamless, making the delivery process stress-free.
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Frequently Asked Questions (FAQ)
Can the Amphenol ICC 12402032E202A be used as a drop-in replacement for the JAE UX100-241#01 in high-vibration applications, and what mechanical retention differences should I consider?
The Amphenol ICC 12402032E202A can serve as a functional USB-C 3.2 Gen 1 receptacle alternative to the JAE UX100-241#01, but key mechanical differences affect suitability in high-vibration environments. Unlike the JAE’s dual-metal housing design, the 12402032E202A relies on steel shielding and integrated board guides with through-hole and surface-mount termination. For robust retention, ensure both the through-hole pins and SMT pads are properly soldered to maximize mechanical stability. In dynamic environments, consider reinforcing with adhesive or a retaining bracket to mitigate long-term solder joint fatigue, especially since the UX100-241#01 has superior inherent rigidity. Always verify mating plug alignment forces to avoid PCB flex during insertion.
How does the dual-mount (SMT + through-hole) design of the Amphenol ICC 12402032E202A impact board warpage risk during reflow, and what profile adjustments are recommended?
The dual-mount configuration of the Amphenol ICC 12402032E202A—combining surface-mount pads with through-hole pins—creates asymmetrical thermal mass, increasing the risk of component tilting or solder voiding during reflow if not managed. To minimize warpage, use a ramp-to-peak thermal profile with controlled heating rates (<2°C/sec) and extend soak time to balance temperature distribution. Consider pin-in-paste (PIP) process for the through-hole leads with adequate hole fill, and validate with pre-production X-ray inspection. Ensure PCB support fixtures prevent flexing under component weight, particularly on larger boards. Stencil aperture design should favor 0.12–0.15mm reduced thickness on SMT pads to control solder volume and prevent tombstoning.
What are the signal integrity risks when routing USB 3.2 Gen 1 differential pairs into the Amphenol ICC 12402032E202A on a 6-layer board, and how can impedance be maintained?
Routing high-speed USB 3.2 Gen 1 (5 Gbps) signals into the Amphenol ICC 12402032E202A on a 6-layer board introduces potential impedance discontinuities at the connector transition. The 12402032E202A’s internal contact geometry can cause minor impedance dips; to compensate, maintain controlled 90Ω differential impedance with tight coupling and avoid stubs or 90° bends within 10mm of the pads. Use ground vias adjacent to each D+/D- via to reduce return path inductance. Reference the power plane (not ground) on Layer 2 for top-layer routing to minimize crosstalk. Simulate the channel including connector models if available, and keep trace lengths matched within ±50 mils to meet USB jitter budgets.
Is the Amphenol ICC 12402032E202A suitable for use in a sealed enclosure exposed to condensation, and what are its long-term reliability risks without IP-rated sealing?
The Amphenol ICC 12402032E202A lacks IP-rated ingress protection and is not recommended for direct exposure to condensation or moisture-laden environments. While it features gold-plated contacts (minimizing corrosion) and stainless steel shielding, prolonged exposure to humidity can lead to electrochemical migration or solder joint degradation, especially under bias. For sealed enclosures where internal condensation may occur, use conformal coating (e.g., acrylic or silicone) over the PCB around the 12402032E202A, and include desiccant or moisture barrier packaging. Also ensure full contact wetting during soldering to prevent moisture entrapment beneath the connector footprint. Consider IP67-rated alternatives like the TE Connectivity 2357427-1 if environmental exposure is unavoidable.
What design-for-repair challenges arise from using the Amphenol ICC 12402032E202A in high-density layouts, and how does its board guide feature affect rework success?
Using the Amphenol ICC 12402032E202A in high-density PCBs presents rework challenges due to limited tool access and the connector’s board guide protruding below the mounting plane. These guides, while aiding alignment during assembly, can interfere with adjacent components and complicate hot air reflow or vacuum extraction. The combination of through-hole and SMT terminations increases thermal demand during rework, risking pad lifting or via damage if uneven heating occurs. To improve rework yield, use precision nozzles with temperature profiling tailored to MSL 1 requirements, pre-tin replacement units, and employ selective bottom-side heating to manage through-hole solder reflow. Maintain ≥2mm clearance around the connector footprint whenever possible to accommodate rework fixtures.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
12402032E202A CAD Models
Amphenol ICC (Commercial Products) 12402032E202A PCB symbols & footprints
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