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10114828-10102LF
Amphenol ICC (FCI)
CONN HEADER SMD 2POS 1.25MM
16948 Pcs New Original In Stock
Connector Header Surface Mount 2 position 0.049" (1.25mm)
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5.0 / 5.0
- (461 Ratings)
10114828-10102LF
Product Overview
1261045
DiGi Electronics Part Number
10114828-10102LF-DGManufacturer
Amphenol ICC (FCI)
10114828-10102LF
Description
CONN HEADER SMD 2POS 1.25MMInventory
16948 Pcs New Original In Stock
Connector Header Surface Mount 2 position 0.049" (1.25mm)
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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10114828-10102LF Technical Specifications
Category
Rectangular Connectors, Headers, Male Pins
Packaging
Tape & Reel (TR)
Series
10114828
Product Status
Active
Connector Type
Header
Contact Type
Male Pin
Pitch - Mating
0.049" (1.25mm)
Number of Positions
2
Number of Rows
1
Row Spacing - Mating
-
Number of Positions Loaded
All
Style
Board to Cable/Wire
Shrouding
Shrouded - 3 Wall
Mounting Type
Surface Mount
Termination
Solder
Fastening Type
Detent Lock
Contact Length - Mating
0.089" (2.25mm)
Contact Length - Post
-
Overall Contact Length
-
Insulation Height
0.185" (4.70mm)
Contact Shape
Rectangular
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Finish - Post
Tin
Contact Material
Copper Alloy
Insulation Material
Liquid Crystal Polymer (LCP)
Features
Solder Retention
Operating Temperature
-40°C ~ 105°C
Ingress Protection
-
Material Flammability Rating
UL94 V-0
Insulation Color
Natural
Current Rating (Amps)
1A
Voltage Rating
125V
Mated Stacking Heights
-
Contact Finish Thickness - Post
-
Applications
-
Base Product Number
10114828
Datasheet & Documents
HTML Datasheet
10114828-10102LF-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Additional Information
Other Names
609-4387-2
609-4387-1
1011482810102LF
609-4387-6
2266-10114828-10102LF
Standard Package
1,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
I recommend DiGi for anyone who desires dependable tech at a reachable price.
de desembre 02, 2025
DiGi Electronics makes technology accessible with affordable prices and friendly service.
de desembre 02, 2025
DiGi Electronics’ packaging standards are top-notch, ensuring full protection for their products.
de desembre 02, 2025
Their low prices enable me to upgrade my equipment more often.
de desembre 02, 2025
I highly recommend DiGi Electronics for anyone needing reliable electronics support.
de desembre 02, 2025
Their commitment to quality at a reasonable price truly stands out.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the 10114828-10102LF connector in high-density PCB layouts with tight thermal cycling?
When integrating the 10114828-10102LF in high-density designs, the 1.25mm pitch limits routing clearance, increasing risk of solder bridging during reflow. Due to its SMD termination and tin-plated copper alloy contacts, thermal mismatch between the PCB and LCP housing can induce solder joint fatigue under repeated thermal cycling (-40°C to 105°C). Mitigate this by ensuring balanced copper pads, using solder retention features as designed, and avoiding via-in-pad near terminals. Also verify reflow profile complies with MSL-1 handling to prevent 'popcorning' even though sensitivity is low.
Can the 10114828-10102LF reliably replace Molex 53047-0210 in compact consumer electronics applications, and what are the mechanical compatibility risks?
Yes, the 10114828-10102LF can serve as a functional alternative to the Molex 53047-0210 in 2-position, 1.25mm pitch applications, but mechanical fit must be verified. While both are shrouded SMD headers with similar mating heights, the Amphenol design uses a 3-wall shroud with detent lock that may not fully engage with the Molex counterpart’s housing. Additionally, contact overlap and mating force differ—use mating cycle data and first-article inspection to confirm durability. Ensure the PCB footprint aligns precisely, as pin post lengths and solder tail geometry differ between manufacturers.
How does the liquid crystal polymer (LCP) insulation in the 10114828-10102LF impact reliability in lead-free reflow assembly processes?
The LCP insulation in the 10114828-10102LF offers high thermal stability (UL94 V-0 rated) and low moisture absorption, making it well-suited for lead-free reflow processes peaking at 260°C. However, excessive dwell time or uneven heating can warp the small 1.25mm-pitch housing due to anisotropic thermal expansion. To ensure reliability, follow a controlled ramp-soak-spike profile, limit peak temperature exposure to under 30 seconds, and confirm post-reflow coplanarity. The MSL-1 rating allows indefinite floor storage, but dry pack storage pre-reflow is still recommended to minimize contamination risks.
What are the signal integrity limitations of using the 10114828-10102LF for high-speed differential pairs in compact IoT modules?
The 10114828-10102LF is not optimized for high-speed signal transmission beyond 100 MHz due to lack of controlled impedance design, absence of shielding, and crosstalk between adjacent pins at 1.25mm pitch. For IoT modules transmitting UART, I2C, or low-speed SPI signals, it performs reliably at 1A and 125V. However, when routing differential pairs, maintain tight twist in wire harnesses and avoid parallel trace runs longer than 50 mm on the PCB to minimize coupling. Use as a power or control signal interconnect instead of high-speed data to avoid EMI and timing skew risks.
What PCB footprint design considerations are critical to prevent misalignment and solder joint failure with the 10114828-10102LF during automated assembly?
To ensure reliable automated assembly of the 10114828-10102LF, design the PCB footprint with precise pad dimensions: slightly shorter in length than the contact post to prevent solder migration, but wide enough to accommodate 0.1mm placement tolerance. Include solder dams between pads to reduce bridging risk. Use NSMD (non-solder-mask-defined) pads with thermal relief elimination for consistent solder wetting. Align the fiducial markers accurately near the connector zone to assist pick-and-place machines. Verify stencil aperture design for 0.15–0.20g of solder paste deposition per pin to fully engage the solder retention feature without excess.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
10114828-10102LF CAD Models
Amphenol ICC (FCI) 10114828-10102LF PCB symbols & footprints
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