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10106813-071112LF
Amphenol ICC (FCI)
CONN SELF-MATE 70POS SMD GOLD
13986 Pcs New Original In Stock
70 Position Connector Self Mating, Non-Gendered, Hermaphroditic Surface Mount Gold or Gold, GXT™
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*Quantity
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5.0 / 5.0
- (209 Ratings)
10106813-071112LF
Product Overview
1337637
DiGi Electronics Part Number
10106813-071112LF-DGManufacturer
Amphenol ICC (FCI)
10106813-071112LF
Description
CONN SELF-MATE 70POS SMD GOLDInventory
13986 Pcs New Original In Stock
70 Position Connector Self Mating, Non-Gendered, Hermaphroditic Surface Mount Gold or Gold, GXT™
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
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Worldwide Delivery in 3-5 Business Days
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10106813-071112LF Technical Specifications
Category
Rectangular Connectors, Arrays, Edge Type, Mezzanine (Board to Board)
Packaging
Cut Tape (CT) & Digi-Reel®
Series
MezzoStak
Product Status
Active
Connector Type
Self Mating, Non-Gendered, Hermaphroditic
Number of Positions
70
Pitch
0.020" (0.50mm)
Number of Rows
2
Mounting Type
Surface Mount
Features
Board Guide, Solder Retention
Contact Finish
Gold or Gold, GXT™
Contact Finish Thickness
15.0µin (0.38µm)
Mated Stacking Heights
4mm, 4.5mm, 5.5mm
Height Above Board
0.140" (3.55mm)
Base Product Number
10106813
Datasheet & Documents
Product Drawings
10106813_2LF Drawing
HTML Datasheet
10106813-071112LF-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Additional Information
Other Names
609-4604-2
609-4604-1
609-4604-6
10106813071112LF
Standard Package
1,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Fast shipping combined with responsive customer support made my first purchase a breeze at Di Digi Electronics.
de desembre 02, 2025
DiGi Electronics makes eco-conscious decisions easy with their affordable pricing.
de desembre 02, 2025
DiGi's delivery process is consistently punctual, reflecting their professionalism.
de desembre 02, 2025
We are pleased with their responsive and attentive support team.
de desembre 02, 2025
Customer service is prompt, friendly, and incredibly knowledgeable—really sets them apart.
de desembre 02, 2025
The build quality of DiGi Electronics products is outstanding, with sturdy materials and precise craftsmanship that feel premium.
de desembre 02, 2025
I highly value their competitive prices and caring customer support.
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Frequently Asked Questions (FAQ)
Can the 10106813-071112LF be used as a drop-in replacement for the Molex PicoBlade 53261-7071 in a high-vibration industrial control board design?
No, the 10106813-071112LF is not a direct drop-in replacement for the Molex PicoBlade 53261-7071 despite both being 70-position connectors. The 10106813-071112LF uses a hermaphroditic, self-mating design with a 0.50mm pitch and surface-mount SMD termination, while the PicoBlade employs a traditional gender-specific plug-and-receptacle system with a 1.25mm pitch and through-hole or SMT options. Mechanically and electrically, they are incompatible—pitch mismatch alone prevents alignment. Additionally, the 10106813-071112LF’s lower profile (3.55mm height) and lack of polarization may introduce misalignment risks in high-vibration environments unless board guides are properly utilized. For vibration resilience, consider reinforcing the 10106813-071112LF with underfill or mechanical bracing if replacing legacy systems.
What are the key reliability risks when using the 10106813-071112LF in a portable medical device subjected to frequent mating cycles and thermal cycling?
The 10106813-071112LF’s hermaphroditic contact design, while space-efficient, introduces reliability concerns under frequent mating (>500 cycles) due to potential contact wear asymmetry and reduced normal force over time. In portable medical devices experiencing thermal cycling, CTE mismatch between the connector housing (typically LCP) and PCB can induce solder joint stress, especially at the perimeter SMT pads. Although the connector includes solder retention features, we recommend implementing corner staking or epoxy underfill to mitigate fatigue. Additionally, the 15µin gold plating (0.38µm) is sufficient for low-current signals but may degrade faster in high-humidity environments—consider conformal coating if used in non-sealed enclosures. Always validate with accelerated life testing under actual use conditions.
How does the 10106813-071112LF compare to the TE Connectivity Micro-MaTch 1-215889-7 for board-to-board stacking in compact consumer electronics?
The 10106813-071112LF offers a lower profile (3.55mm vs. 4.2mm for the Micro-MaTch) and true hermaphroditic mating, eliminating the need for matched male/female pairs—ideal for modular designs. However, the TE Micro-MaTch 1-215889-7 uses a 1.27mm pitch with higher current capacity per pin and better polarization, reducing mis-mating risk during assembly. The 10106813-071112LF’s 0.50mm pitch demands tighter PCB tolerances and more precise reflow profiling. For high-volume consumer apps where automated assembly speed matters, the Micro-MaTch may be preferable; for space-constrained, symmetrical stacking (e.g., foldable devices), the 10106813-071112LF’s self-mating feature provides a unique advantage—but ensure your pick-and-place machine can handle its fine pitch reliably.
Is it safe to mate and unmate the 101068113-071112LF repeatedly during prototyping or field servicing without damaging the contacts?
Repeated mating during prototyping or field service can compromise the 10106813-071112LF’s contact integrity over time. While rated for typical connector lifecycles (often 500–1,000 cycles in similar Amphenol MezzoStak series), the hermaphroditic design relies on dual-beam contacts that may experience work hardening or fretting corrosion with frequent handling—especially if misaligned during manual mating. Unlike polarized connectors, the non-gendered interface increases the risk of off-angle engagement, accelerating wear. For development, use a dedicated test fixture with guided alignment. In field-serviceable designs, limit user-accessible mating or specify a more robust, service-rated alternative. Always inspect contact surfaces for discoloration or deformation after extended use.
Can the 10106813-071112LF support high-speed signals like USB 3.0 or PCIe Gen 2 in a compact embedded system?
The 10106813-071112LF is not optimized for high-speed differential signaling such as USB 3.0 or PCIe Gen 2. Its 0.50mm pitch and lack of controlled impedance design (no ground shielding between signal pairs) can lead to crosstalk and impedance discontinuities above 1 Gbps. While it may pass lower-speed USB 2.0 signals in short-reach applications, signal integrity degrades significantly with longer trace lengths or dense routing. For high-speed designs, consider Amphenol’s Minitek® Pwr or Airmax® series with shielded differential pairs. If you must use the 10106813-071112LF, route critical signals on inner layers with adjacent ground planes, minimize stub lengths, and perform SI simulation—but expect trade-offs in eye diagram margin and EMI performance.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
10106813-071112LF CAD Models
Amphenol ICC (FCI) 10106813-071112LF PCB symbols & footprints
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