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10061913-101CLF
Amphenol ICC (FCI)
CONN PCI EXP FMALE 64POS 0.039
2239 Pcs New Original In Stock
64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black
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(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (320 Ratings)
10061913-101CLF
Product Overview
1318647
DiGi Electronics Part Number
10061913-101CLF-DGManufacturer
Amphenol ICC (FCI)
10061913-101CLF
Description
CONN PCI EXP FMALE 64POS 0.039Inventory
2239 Pcs New Original In Stock
64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
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10061913-101CLF Technical Specifications
Category
Card Edge Connectors, Edgeboard Connectors
Packaging
Tray
Series
-
Product Status
Active
Card Type
PCI Express™
Gender
Female
Number of Positions/Bay/Row
11; 21
Number of Positions
64
Card Thickness
0.062" (1.57mm)
Number of Rows
2
Pitch
0.039" (1.00mm)
Read Out
Dual
Features
Board Guide, Locking Ramp, Pick and Place, Solder Retention
Mounting Type
Surface Mount
Termination
Solder
Contact Material
Copper Alloy
Contact Finish
Gold
Contact Finish Thickness
30.0µin (0.76µm)
Contact Type
Cantilever
Color
Black
Flange Feature
-
Operating Temperature
-55°C ~ 85°C
Material - Insulation
Polyamide (PA), Nylon, Glass Filled
Base Product Number
10061913
Datasheet & Documents
Product Drawings
10061913 Drawing
HTML Datasheet
10061913-101CLF-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Additional Information
Other Names
10061913101CLF
2266-10061913-101CLF
609-2883
Standard Package
60
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Ich schätze die umweltfreundliche Herangehensweise bei der Verpackung sehr. Es ist schön zu wissen, dass die Firma auf Nachhaltigkeit achtet.
de desembre 02, 2025
I appreciate how quickly my orders arrive and how resilient their products are during heavy use.
de desembre 02, 2025
I have no hesitation recommending DiGi Electronics due to their excellent quality and customer care.
de desembre 02, 2025
Reliable and speedy order fulfillment has enhanced our overall procurement experience.
de desembre 02, 2025
Reliable hardware at such an affordable price is a rare find in the gaming industry.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the 10061913-101CLF in a high-vibration industrial environment, and how can mechanical stability be ensured?
When integrating the 10061913-101CLF into high-vibration applications, the primary risk is mechanical loosening of the mating connection due to its surface-mount solder termination without integral mechanical fasteners. To mitigate this, ensure robust PCB pad design per IPC-7351, use of solder with proper wetting characteristics, and consider adhesive reinforcement near the connector base. The built-in locking ramp helps retain the card, but for extreme environments, add a secondary retention mechanism like a screw-mounted bracket. Also verify board stiffness—thin PCBs may flex and crack SMT joints over time under vibration stress with the 10061913-101CLF.
How does the 10061913-101CLF compare to Molex 56557-64DA in mixed-signal PCIe designs with tight EMI requirements?
The 10061913-101CLF and Molex 56557-64DA both support PCIe Gen 3 signaling, but the 10061913-101CLF’s glass-filled polyamide housing offers slightly better dielectric stability over temperature, which improves impedance consistency in high-speed mixed-signal designs. However, the Molex part includes internal grounding fingers that reduce crosstalk and EMI, which the 10061913-101CLF lacks. For EMI-sensitive applications using the 10061913-101CLF, implement additional board-level shielding and route high-speed lanes away from noisy analog sections. Also ensure uninterrupted ground planes beneath the 10061913-101CLF’s footprint to compensate for reduced shielding.
Can the 10061913-101CLF be used as a drop-in replacement for the Amphenol 10061911-101RLF in a legacy PCIe x4 system upgrade, and what layout checks are needed?
The 10061913-101CLF can serve as a functional replacement for the Amphenol 10061911-101RLF in PCIe x4 upgrades, as both share identical pitch, card thickness compatibility, and dual-row SMT layout. However, verify that the locking ramp geometry is compatible with the existing daughter card—minor molding differences may affect insertion force or retention. Also check the pick-and-place footprint: although pin-compatible, the body dimensions of the 10061913-101CLF may differ slightly, affecting automated assembly alignment. Update solder paste stencil design if necessary and confirm MSL 1 handling matches existing reflow profiles.
What are the signal integrity trade-offs when routing differential pairs through the 10061913-101CLF in PCIe Gen 4 designs?
While the 10061913-101CLF was designed for PCIe Gen 3, it may be used cautiously in Gen 4 applications with signal integrity compromises. The cantilever contact design and 1.00mm pitch create higher discontinuities in impedance and increased crosstalk at 16 GT/s. To maintain performance with the 10061913-101CLF, limit trace lengths through the connector, use controlled impedance routing (target 85Ω ±10%), minimize stubs, and simulate the channel including the connector’s S-parameters if available. Avoid routing critical lanes through outer positions where coupling is less uniform. Consider upgrading to a Gen 4-verified connector if bit error rate (BER) below 1e-12 is required.
What reflow soldering profile considerations are critical for ensuring long-term reliability of the 10061913-101CLF on high-density PCBs?
For reliable solder joints with the 10061913-101CLF on high-density boards, adhere to a precise reflow profile: preheat ramp rate ≤2°C/sec to prevent tombstoning or voiding, peak temperature between 240–260°C for Sn-Ag-Cu alloys, and ensure the connector body temperature does not exceed 260°C for more than 30 seconds to avoid nylon-based polyamide (PA) insulation warping. Use nitrogen-assisted reflow to reduce oxidation on the 30µin gold-plated copper alloy contacts. Additionally, balance thermal mass in adjacent large ground pads to avoid uneven solder flow—thermal relief spokes are recommended near solder retention features of the 10061913-101CLF to prevent lift-off during cooling.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
10061913-101CLF CAD Models
Amphenol ICC (FCI) 10061913-101CLF PCB symbols & footprints
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