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10053363-200LF
Amphenol ICC (FCI)
CONN EDGE DUAL FML 64POS 0.100
2130 Pcs New Original In Stock
64 (Power) Position Female Connector Non Specified - Dual Edge Gold 0.100" (2.54mm) Black
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*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (252 Ratings)
10053363-200LF
Product Overview
1285664
DiGi Electronics Part Number
10053363-200LF-DGManufacturer
Amphenol ICC (FCI)
10053363-200LF
Description
CONN EDGE DUAL FML 64POS 0.100Inventory
2130 Pcs New Original In Stock
64 (Power) Position Female Connector Non Specified - Dual Edge Gold 0.100" (2.54mm) Black
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
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10053363-200LF Technical Specifications
Category
Card Edge Connectors, Edgeboard Connectors
Packaging
Tray
Series
Power Edge
Product Status
Active
Card Type
Non Specified - Dual Edge
Gender
Female
Number of Positions/Bay/Row
32
Number of Positions
64 (Power)
Card Thickness
0.062" (1.57mm)
Number of Rows
2
Pitch
0.100" (2.54mm)
Read Out
Dual
Features
Board Guide
Mounting Type
Through Hole, Right Angle
Termination
Solder
Contact Material
Copper Alloy
Contact Finish
Gold
Contact Finish Thickness
30.0µin (0.76µm)
Contact Type
Cantilever
Color
Black
Flange Feature
-
Operating Temperature
-5°C ~ 105°C
Material - Insulation
Thermoplastic
Base Product Number
10053363
Datasheet & Documents
Product Drawings
10053363 Drawing
HTML Datasheet
10053363-200LF-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Additional Information
Other Names
10053363-200LF-DG
609-2861
Standard Package
24
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Une équipe de véritables professionnels, toujours à l’écoute et très compétente.
de desembre 02, 2025
Their customer service team is professional and handled my inquiry efficiently.
de desembre 02, 2025
They demonstrated reliability and professionalism in both logistics and after-sales support.
de desembre 02, 2025
Reliable delivery and secure packaging make them my preferred vendor.
de desembre 02, 2025
Tracking information was accurate and provided at every step.
de desembre 02, 2025
The delivery personnel are punctual and courteous, ensuring a positive experience.
de desembre 02, 2025
Speedy shipping made my experience excellent—my order arrived before I knew it.
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Frequently Asked Questions (FAQ)
What are the key design risks when using the 10053363-200LF in high-vibration environments, and how can board layout mitigate contact fretting?
The 10053363-200LF uses a cantilever contact design, which offers good normal force but is more susceptible to micro-motion under sustained vibration compared to dual-beam or spring-loaded alternatives. In high-vibration applications (e.g., industrial automation or transportation), this can lead to fretting corrosion and increased contact resistance over time. To mitigate this, ensure the PCB is rigidly supported near the connector, use strain relief for mating cards, and consider adding mechanical fasteners or stiffeners. Avoid placing the 10053363-200LF on flexible or cantilevered sections of the board, and verify mating alignment to prevent off-axis insertion forces that exacerbate wear.
Can the 10053363-200LF be safely replaced with a Samtec MEC2-032-02-L-D-EM2 in a 64-position power edge application, and what trade-offs should I expect?
While the Samtec MEC2-032-02-L-D-EM2 offers similar pitch (2.54mm) and dual-row configuration, it is not a drop-in replacement for the 10053363-200LF due to differences in card thickness compatibility (MEC2 supports 1.6mm vs. 1.57mm nominal for the Amphenol part) and mounting footprint. The Samtec connector uses a different contact geometry and may require PCB layout changes. Additionally, the 10053363-200LF includes integrated board guides for alignment, which the MEC2 lacks, increasing risk of misalignment during mating. If space and mechanical constraints allow, the Samtec part offers higher cycle life, but only after thorough validation of insertion force, thermal performance, and long-term reliability in your specific environment.
How does the 30µin gold plating on the 10053363-200LF impact long-term reliability in humid or sulfur-rich environments, and is it sufficient for low-voltage signal lines alongside power?
The 30µin (0.76µm) gold flash on the 10053363-200LF is adequate for power contacts where wiping action and high normal force help penetrate surface films, but it may be insufficient for low-level signal lines (<100mV) in high-humidity or H₂S-containing environments (e.g., wastewater facilities or certain industrial settings). In such cases, pore corrosion can develop over time, increasing contact resistance on signal pins. For mixed-signal applications, consider segregating signal and power contacts, using conformal coating, or upgrading to a connector with 50µin minimum gold plating. Alternatively, apply a protective lacquer or use redundant signal paths to mitigate open-circuit risk.
What PCB design constraints must be observed when routing high-current traces to the through-hole pins of the 10053363-200LF to avoid thermal stress during soldering?
The 10053363-200LF’s through-hole solder termination requires careful thermal management during reflow or wave soldering. Large copper pours or planes connected directly to the power pins can act as heat sinks, leading to cold solder joints or warpage. Use thermal relief pads on all through-hole connections—especially for the 64 power positions—to balance solderability and electrical performance. Ensure trace widths are calculated for expected current (e.g., 10A per contact may require 50–70 mil traces depending on copper weight), but avoid excessive copper near the connector body that could distort the thermoplastic housing during soldering. Maintain a minimum 0.5mm clearance between the connector flange and nearby components to allow for proper solder fillet formation.
Is the 10053363-200LF suitable for hot-swapping applications, and what circuit-level protections are necessary to prevent arcing or latch-up?
The 10053363-200LF is not inherently designed for hot-swapping, as its cantilever contacts and lack of staggered pin lengths increase the risk of arcing during live insertion/removal. If used in hot-swap scenarios (e.g., redundant power modules), implement circuit-level protections such as pre-charge circuits, current-limiting MOSFETs, or hot-swap controllers (e.g., TI TPS2490) to manage inrush current. Additionally, ensure the mating sequence aligns with system requirements—ground pins should make first and break last. Without these safeguards, repeated hot-swapping can degrade the gold plating and lead to contact welding or system latch-up, especially at higher voltages (>24V) or currents (>5A per contact).
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
10053363-200LF CAD Models
Amphenol ICC (FCI) 10053363-200LF PCB symbols & footprints
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