The JST BM06 is a 6-pin, 1.0 mm-pitch board-to-cable connector built for compact sensor modules. This article covers BM06 variants, mating with SHR-06V-S housings, crimp/IDC wiring, and PCB footprints with solder tabs. It explains limits, pin maps for I²C/SPI/UART, wiring rules, ESD defenses, and power practices.
BM06 3D Sensor Connector Overview
The BM06 3D sensor connector from JST’s SH/SR family is a compact 6-pin solution designed with a 1.0 mm pitch, making it a reliable board-to-cable interface for today’s space-constrained sensor modules. Its strong design ensures secure mating while allowing both power and data lines to pass through a single connector, reducing PCB clutter. This versatility supports common serial communication protocols such as I²C, SPI, and UART, giving flexibility in system integration. In harsh industrial environments, the BM06 is valued for its ability to make 3D sensor ICs truly plug-and-play while maintaining long-term signal integrity. Whether used in precision motion systems or vision-based robotics, the BM06 stands out as a tiny but best connector.
BM06 Variants and Applications
| Part Number | Feature | Best Use Case |
|---|---|---|
| BM06B-SRSS-TB | Standard SMT, top-entry | Most common option for compact PCB sensor boards where vertical space is limited. |
| BM06B-SRSS-TBT | Tape-and-reel packaging | Best for automated pick-and-place machines in high-volume manufacturing. |
| BM06B-SRSS-G-TB | Guideposts for alignment | Perfect for precision sensor modules requiring exact positioning during assembly. |
BM06 Mating Hardware and Wiring Options
Receptacle Housing (SHR-06V-S)
The SHR-06V-S is a 6-position receptacle housing designed to pair perfectly with the BM06 header. It ensures a secure mechanical fit while maintaining stable electrical contact, which is basic for sensor boards and compact electronic modules.
Crimp Contacts
BM06 connectors use crimp-type contacts that accept 28–30 AWG stranded wire. This design provides both flexibility and durability, making it suitable for small-scale sensor wiring where space is limited but reliability is required.
IDC (Insulation Displacement) Options
For applications requiring flat ribbon cables, IDC options are available. These are useful in dense layouts or automated harness assembly, helping streamline production and reduce assembly time.
Wire Selection Tips
When designing for moving applications such as robotic arms or sensor probes, stranded conductors are recommended. Their flexibility reduces stress on the connector and helps prevent premature fatigue failures in different environments.
System-Level Advantage
Selecting the right housing, terminals, and wiring ensures long-term reliability. With proper pairing, you can achieve low contact resistance, extended connector lifespan, and stable performance even in harsh industrial conditions.
BM06 PCB Footprint and Mechanical Design
This image illustrates the BM06 3D sensor connector’s PCB footprint and mechanical design, highlighting features that support stability and reliable use.
On the left, the footprint layout shows the pad arrangement for soldering, with a 1.0 mm pitch between pins and an overall width of about 4.25 mm. The drawing emphasizes the inclusion of solder tabs, which strengthen the connector’s attachment to the PCB and help resist mechanical stress during handling or operation.
On the right, the mechanical housing of the connector is shown. It features a shrouded design that protects the terminals and ensures proper alignment. This design also provides anti-mis-mating protection, preventing incorrect connections and improving long-term reliability in applications where repeated plugging and unplugging occur.
BM06 3D Sensor Connector Electrical Specifications
| Parameter | Specification |
|---|---|
| Rated Current | 1.0 A (per pin, max) |
| Rated Voltage | 50 V AC/DC |
| Contact Resistance | ≤ 20 mΩ |
| Insulation Resistance | ≥ 100 MΩ (at 500 V DC) |
| Withstanding Voltage | 500 V AC for 1 minute |
| Operating Temperature | -25 °C to +85 °C |
| Applicable Wire Range | AWG 28–30 (stranded) |
| Mating Cycles | 50 cycles (typical) |
BM06 6-Pin Recommended Mapping
| Pin | Suggested Signal | Function / Benefit |
|---|---|---|
| 1 | VCC | Provides a stable supply voltage to the sensor IC. |
| 2 | GND | Establishes ground return for signal integrity. |
| 3 | SCL / SCLK | Clock line for I²C or SPI communication. |
| 4 | SDA / MOSI | Data input line, supporting both I²C and SPI. |
| 5 | MISO / INT | Sensor output or interrupt signaling for host notification. |
| 6 | CS / WAKE | Chip select in SPI mode or wake-up trigger in low-power designs. |
Cabling Tips for BM06 Signal Integrity
I²C Length Control
For I²C buses, harness length should be carefully managed. Keep runs within 200–300 mm at a 100 kHz clock speed to maintain signal stability. If longer runs are required, the bus speed must be reduced to avoid timing issues and communication errors.
SPI Line Damping
Adding series resistors in the range of 33–100 Ω to SPI clock and data lines is a proven way to reduce signal reflections. This simple adjustment improves signal integrity, making waveforms cleaner and ensuring reliable transfers even in compact layouts.
Ground Pairing
To limit electromagnetic interference (EMI), always pair or twist ground wires with clock or data lines. This approach creates a return path close to the signal line, which minimizes noise pickup and stabilizes overall communication.
Shielding for Harsh Environments
When BM06-connected sensors are used near motors, lasers, or high-power switching circuits, shielding is required. Shielded cables prevent cross-talk, reduce EMI, and protect data integrity under demanding industrial conditions.
BM06 ESD and Surge Protection Strategies
| Protection Method | Device Example | Placement |
|---|---|---|
| TVS Diode | PESD5V0S1UL | Place at the connector entrance to clamp fast ESD transients. |
| RC Filter | R = 100 Ω, C = 100 pF | Apply on interrupt or wake pins to suppress noise spikes. |
| Ground Return | Wide copper pour | Ensure a low-impedance discharge path for safe ESD current flow. |
Power Management Tips for BM06
Low-IQ LDO Regulators
Efficient low-quiescent-current LDOs such as TPS7A02 or MIC5365 are recommended to power BM06-connected sensors. They keep supply rails stable, reduce noise, and minimize power draw, an advantage in battery-powered or energy-sensitive applications.
Decoupling and Bulk Capacitors
A combination of bulk electrolytic capacitors and 100 nF ceramic capacitors should be placed close to the BM06 connector pins. This pairing smooths ripple, absorbs transients, and ensures sensors receive clean, uninterrupted power.
Load Switch Integration
Using a load switch like the TPS22919 helps manage inrush currents during hot-plug events. It isolates sensitive circuits, protects upstream power rails, and prevents sudden voltage drops that could disrupt sensor operation.
Bypass Placement Strategy
All bypass capacitors should be located within the BM06 connector’s shadow area. Keeping loop areas small enhances noise immunity and improves the system’s transient response in high-speed designs.
System-Level Reliability
Applying these power management practices ensures sensor modules perform consistently during startup, hot-plugging, and continuous operation.
Time-of-Flight (ToF) Sensor Options with BM06
| IC Model | Max Range | Zones | Interface | Use |
|---|---|---|---|---|
| VL53L1X | \~4 m | Single zone | I²C | Entry-level distance sensing for drones, presence detection, and electronics. |
| VL53L5CX | \~4 m | 8×8 multizone | I²C | Advanced 3D mapping, robotics navigation, and obstacle avoidance in complicated environments. |
BM06 Sensor Reliability Checklist
Continuity & Polarity Under Strain
Verify that wiring remains correct and uninterrupted when the connector is bent, twisted, or stressed in realistic mounting conditions.
Electrostatic Discharge (ESD) Endurance
Test connectors against ±8 kV contact discharge to confirm resistance to static shocks during handling or field use.
Current Load & Thermal Rise
Apply maximum rated current and measure the temperature rise at the connector. Overheating signals a risk of long-term reliability issues.
Vibration Resistance
Expose mated connectors to vibration profiles simulating machinery and automotive environments to ensure no intermittent contact.
Mating Cycle Durability
Perform repeated insertion and removal (>50 cycles minimum) to confirm that plating, contact force, and locking features remain intact.
Signal Integrity Validation
Measure I²C rise times and SPI eye diagrams with the final harness to verify adequate signal margin for digital communication.
BM06 Connector Sourcing and Packaging Guide
| Variant | Packaging / Feature |
|---|---|
| BM06B-SRSS-TBT | Tape-and-reel packaging for automated SMT lines |
| BM06B-SRSS-G-TB | Guideposts for precise PCB alignment |
| SHR-06V-S | Matching receptacle housing for BM06 headers |
Right ICs for BM06-Connected Modules
| Category | Purpose | IC | Brand | Package | Key Features / Notes |
|---|---|---|---|---|---|
| Voltage Regulation (LDOs) | Provide stable 3.3V/5V power to BM06-connected modules (ToF sensors, laser heads, MCUs). | TPS7A02 | Texas Instruments | X2SON-4 (1.0 × 1.0 mm) | Ultra-low IQ (25 nA), battery-friendly, compact. |
| Voltage Regulation (LDOs) | Provide stable 3.3V/5V power to BM06-connected modules (ToF sensors, laser heads, MCUs). | MIC5365-3.3YC5-TR | Microchip | SC-70-5 | Fast startup, low dropout, space-optimized. |
| Voltage Regulation (LDOs) | Provide stable 3.3V/5V power to BM06-connected modules (ToF sensors, laser heads, MCUs). | LT3042 | Analog Devices | DFN-10 | Ultra-low noise (0.8 µVRMS), high PSRR, precision analog loads. |
| Voltage Regulation (LDOs) | Provide stable 3.3V/5V power to BM06-connected modules (ToF sensors, laser heads, MCUs). | ADM7155 | Analog Devices | LFCSP-10 | Ultra-low noise, stable for RF/clock power. |
| Voltage Regulation (LDOs) | Provide stable 3.3V/5V power to BM06-connected modules (ToF sensors, laser heads, MCUs). | LDLN025 | STMicroelectronics | DFN-6 | 6.5 µVRMS noise, low IQ, up to 250 mA. |
| TVS / ESD Protection | Safeguard BM06 interface signals from ESD spikes or surges. | TPD1E04U04QDBVRQ1 | Texas Instruments | SOT-23 | Automotive-grade ESD diode, 3.3V/5V signals, low capacitance. |
| TVS / ESD Protection | Safeguard BM06 interface signals from ESD spikes or surges. | PESD5V0S1UL | Nexperia | SOD-323 | Ultra-low capacitance, high-speed signal protection. |
| TVS / ESD Protection | Safeguard BM06 interface signals from ESD spikes or surges. | ESD9M5V | ON Semiconductor | SOD-923 | Sub-1 pF capacitance, ultra-miniature TVS. |
| TVS / ESD Protection | Safeguard BM06 interface signals from ESD spikes or surges. | USBLC6-2SC6 | STMicroelectronics | SOT-23-6 | Dual-line protection array for data lines. |
| Communication ICs (Level Shifters / UART Bridges) | Ensure reliable I²C, UART, GPIO comms; bridge voltage domains. | TXS0102DCUR | Texas Instruments | VSSOP-8 | 2-bit bidirectional level shifter, I²C/GPIO up to 100 kbps. |
| Communication ICs (Level Shifters / UART Bridges) | Ensure reliable I²C, UART, GPIO comms; bridge voltage domains. | SC16IS740IPW | NXP Semiconductors | TSSOP-16 | I²C/SPI-to-UART bridge, adds UART via I²C. |
| Communication ICs (Level Shifters / UART Bridges) | Ensure reliable I²C, UART, GPIO comms; bridge voltage domains. | PCA9306DCU | Texas Instruments | VSSOP-8 | Dual-supply I²C translator, 1.2V–3.3V bridging. |
| Communication ICs (Level Shifters / UART Bridges) | Ensure reliable I²C, UART, GPIO comms; bridge voltage domains. | MAX14830ETM+ | Analog Devices (Maxim) | TQFN-40 | Quad UART with I²C/SPI control, high-density serial. |
| Communication ICs (Level Shifters / UART Bridges) | Ensure reliable I²C, UART, GPIO comms; bridge voltage domains. | TXB0104 | Texas Instruments | TSSOP-14 | 4-bit bidirectional translator, auto-direction. |
| Communication ICs (Level Shifters / UART Bridges) | Ensure reliable I²C, UART, GPIO comms; bridge voltage domains. | LTC4311 | Analog Devices | DFN-8 | Active I²C buffer, improves signal integrity over long runs. |
| Microcontrollers (Low-Power MCUs) | Act as main controllers for BM06 sensor interfaces, ultra-low power. | MSP430FR2355IRHAR | Texas Instruments | VQFN-32 | FRAM MCU, multiple ADCs/timers, <1 µA sleep. |
| Microcontrollers (Low-Power MCUs) | Act as main controllers for BM06 sensor interfaces, ultra-low power. | ATTINY1617-MNR | Microchip | VQFN-20 | Compact 8-bit MCU, multiple serial interfaces, <100 nA sleep. |
| Microcontrollers (Low-Power MCUs) | Act as main controllers for BM06 sensor interfaces, ultra-low power. | RA2L1 (e.g., R7FA2L1AB2DFM) | Renesas | QFN-32 | Cortex-M23, flexible power modes, small footprint. |
| Microcontrollers (Low-Power MCUs) | Act as main controllers for BM06 sensor interfaces, ultra-low power. | STM32L031K6T6 | STMicroelectronics | LQFP-32 | Cortex-M0+, I²C/UART/SPI + ADC, low-power industrial. |
| Microcontrollers (Low-Power MCUs) | Act as main controllers for BM06 sensor interfaces, ultra-low power. | Ambiq Apollo3 Blue | Ambiq | QFN/BGA | Industry-leading ultra-low power MCU (<1 µA sleep, BLE). |
| Microcontrollers (Low-Power MCUs) | Act as main controllers for BM06 sensor interfaces, ultra-low power. | STM32U0 / STM32L4+ | STMicroelectronics | QFN/LQFP | Advanced ultra-low power Cortex-M series, efficient sleep modes. |
| Microcontrollers (Low-Power MCUs) | Act as main controllers for BM06 sensor interfaces, ultra-low power. | nRF52840 | Nordic Semi | QFN-48 | Cortex-M4, built-in BLE/2.4 GHz radio, low-power IoT. |
Conclusion
Choosing the right BM06 type, securing the footprint, and applying good wiring and power design make this small connector reliable for robotics, automation, and 3D sensing. Keep I²C short or slow, damp SPI, twist returns, shield near noise sources, clamp ESD, add RC where needed, and manage power with low-IQ LDOs, bulk/decoupling caps, and load switches.
Frequently Asked Questions
Q1. What is the BM06 connector’s mating retention force?
About 10–15 N, depending on housing and crimp quality.
Q2. Can the BM06 connector be hot plugged?
Not directly. Use load switches or inrush control to avoid damage.
Q3. Are side-entry BM06 variants available?
Yes, JST offers right-angle versions for low-profile designs.
Q4. What plating does BM06 contacts use?
Standard contacts use tin-over-nickel plating. Gold-plated options are available for higher durability.
Q5. How does the BM06 handle vibration?
Works well in light to moderate vibration. For harsh conditions, add strain relief or retention methods.
Q6. What are the proper storage guidelines for BM06 connectors?
Store at 5–35 °C in dry conditions. Use within one year to avoid tin oxidation.