Electronic Circuits: Specifications, PCB Layout, and Testing 

d’oct. 24 2025
Source: DiGi-Electronics
Browse: 1838

Electronic circuit design is the process of planning, testing, and building circuits that perform specific tasks. It involves defining requirements, choosing reliable parts, creating schematics, simulating performance, and testing the final design. By following careful steps, circuits become safe, efficient, and dependable. This article provides detailed information on each stage of the design process. 

Figure 1. Electronic Circuit Design

Electronic Circuit Design Overview  

Electronic circuit design is the process of planning and building circuits that can perform a specific task. It begins with small experiments on a breadboard or through computer simulations to check if the idea works. After that, the design is drawn in a schematic diagram that shows how each part is connected. The design is transferred to a printed circuit board (PCB), which can be produced and assembled into a working system. 

This process often combines different types of signals. Analog circuits work with smooth and continuous signals, while digital circuits work with signals that switch between two states. Sometimes, both are combined in the same design to make the system more complete. 

The goal of electronic circuit design is to create a final product that is not only functional but also reliable and ready for use in real conditions. Careful design helps make sure the circuit will work properly, remain stable, and meet safety requirements. 

Requirements to Technical Specifications 

CategoryExample Specifications
ElectricalInput voltage: 5–12 V, Current draw: <1 A, Bandwidth: 10 MHz
TimingLatency < 50 ns, Clock jitter < 2 ps
EnvironmentalOperates -40°C to +85°C, 90% humidity
MechanicalPCB size: 40 × 40 mm, Weight < 20 g
ComplianceMust meet CE/FCC, EMC Class B
Cost/ProductionBOM cost <\$5, Assembly yield >95%

System Architecture and Block Diagram Design 

Figure 2. System Architecture and Block Diagram Design

This block diagram illustrates the core structure of an electronic system by breaking it down into interconnected subsystems. The Power Subsystem supplies stable energy through batteries, DC-DC converters, and regulators, forming the foundation for all other blocks. At the center is the Control Subsystem, which houses a microcontroller, FPGA, or processor responsible for managing data flow and decision-making. 

The Analog Subsystem handles real-world signals using sensors, amplifiers, and filters, while the Digital I/O enables communication with external devices through standards like USB, SPI, UART, CAN, and Ethernet. A separate Clocking & Timing block ensures synchronization with oscillators, PLLs, and precise routing for low jitter performance. 

To maintain reliability, Isolation Zones are emphasized, which keep noisy digital signals away from sensitive analog circuits, reducing interference and improving system stability. 

Basic Components in Electronic Circuit Design 

Figure 3. Basic Components in Electronic Circuit Design

Resistors  

These are used to limit and control the flow of electric current. By adding resistance, they make sure that sensitive parts of a circuit are not damaged by too much current. 

Capacitors 

It acts as a small energy storage device. They hold an electrical charge and can release it quickly when needed. This makes them useful for stabilizing voltage, filtering signals, or supplying short bursts of power. 

Transistors  

It serves as switches and amplifiers. They can turn the current on or off like a controlled gate or make weak signals stronger. Transistors are a part of modern electronics because they allow circuits to process and control information. 

Diodes  

Guide the direction of the current. They allow electricity to flow in only one direction, blocking it the other way. This protects circuits from reverse currents that could cause damage. 

Component Research and Selection in Electronic Circuit Design 

Performance Considerations 

When choosing parts for a circuit, one of the first things to check is performance. This means looking at how the component will behave in the design. Required details include how much noise it adds, how stable it is over time, how much power it uses, and how well it handles signals. These factors decide if the circuit will work the way it is supposed to. 

Package Selection 

The package of a component is the way it is built and sized. It affects how much space it takes on the board, how much heat it can handle, and how easy it is to place during assembly. Smaller packages save space, while larger ones can be easier to work with and handle heat better. Picking the right package helps balance space, heat, and ease of use. 

Availability and Supply Chain 

It is not enough for a part to work well; it also must be available when needed. You should check if the part can be bought from more than one supplier and if it will still be produced in the future. This reduces the risk of delays or redesigns if the part suddenly becomes hard to find. 

Compliance and Standards 

Electronics must follow rules for safety and the environment. Parts are often required to meet standards such as RoHS, REACH, or UL. These approvals make sure the component is safe to use, does not harm the environment, and can be sold in different regions. Compliance is a main part of selecting components. 

Reliability and Derating 

Reliability means how long and how well a component can keep working under normal use. To make parts last longer, You should avoid pushing them to their maximum limits. This practice is called derating. By giving parts a safe margin, the chances of failure go down, and the whole system becomes more dependable. 

Types of Circuit Simulations in Electronic Circuit Design 

Simulation TypePurpose in Circuit Design
DC BiasConfirms that all devices operate at the correct voltage and current points. Prevents transistors from saturating or cutting off unintentionally.
AC SweepEvaluates frequency response, gain, and phase margin. Basic for amplifiers, filters, and stability analysis.
TransientAnalyzes time-domain behavior such as switching, startup response, rise/fall times, and overshoot.
Noise AnalysisPredicts circuit sensitivity to electrical noise and helps optimize filtering strategies for low-noise applications.
Monte CarloTests statistical variation in component tolerances (resistors, capacitors, transistors), ensuring design robustness across manufacturing spread.
ThermalEstimates heat dissipation and identify potential hotspots, which is required for power circuits and compact designs.

Power Delivery and Signal Integrity in Circuit Design 

Power Delivery Network (PDN) Practices 

• Star Grounding: Use a star connection to minimize ground loops. This reduces noise and ensures consistent reference potential across the board. 

• Short Return Paths: Always provide direct and low impedance return paths for current. Long loops increase inductance and inject noise into sensitive circuits. 

• Decoupling Capacitors: Place small-value decoupling capacitors as close as possible to IC power pins. They act as local energy reservoirs and suppress high-frequency transients. 

• Bulk Capacitors: Add bulk capacitors near power entry points. These stabilize the supply during sudden load changes. 

Signal Integrity (SI) Considerations 

• Controlled Impedance Routing: High-speed traces should be routed with defined impedance (typically 50 Ω single-ended or 100 Ω differential). This prevents reflections and data errors. 

• Ground Management: Keep analog and digital grounds separated to avoid interference. Connect them at a single point to maintain a clean reference plane. 

• Crosstalk Reduction: Maintain spacing between parallel high-speed lines or use ground guard traces. This minimizes coupling and preserves signal quality. 

• Layer Stackup: In multilayer PCBs, dedicate continuous planes for power and ground. This reduces impedance and helps control EMI. 

PCB Layout in Circuit Design 

Component Placement 

Figure 4. Component Placement

 Place components based on function and signal flow. Group related parts together and minimize trace lengths, especially for high-speed or sensitive analog circuits. Basic components like oscillators or regulators should be positioned close to the ICs they support. 

Signal Routing 

Figure 5. Signal Routing

 Avoid 90° trace bends to reduce impedance discontinuities and potential EMI. For differential pairs, such as USB or Ethernet, keep trace lengths matched to maintain timing integrity. Separate analog and digital signals to prevent interference. 

Layer Stack-Up 

Figure 6. Layer Stack-Up

 A balanced and symmetrical layer stack-up improves manufacturability, reduces warpage, and provides consistent impedance. Dedicated ground and power planes lower noise and stabilize voltage delivery. 

High-Speed Considerations 

Figure 7. High-Speed Considerations

 Route high-speed signals with controlled impedance, maintain continuous reference planes, and avoid stubs or unnecessary vias. Keep return paths short to minimize inductance and preserve signal integrity. 

Thermal Management 

Figure 8. Thermal Management

 Place thermal vias beneath power devices to spread heat into the inner copper planes or the opposite side of the PCB. Use copper pours and heat-spreading techniques for high-power circuits. 

Schematic Design and ERC in Circuit Development 

Schematic Design Steps 

• Hierarchical Sheets: Break down the design into logical sections such as power, analog, and digital subsystems. This keeps complex circuits organized and makes future debugging or updates easier. 

• Meaningful Net Naming: Use descriptive net names instead of generic labels. Clear naming avoids confusion and speeds up troubleshooting. 

• Design Attributes: Include voltage ratings, current requirements, and tolerance information directly in the schematic. This helps during review and ensures components are selected with the right specifications. 

• Footprint Synchronization: Link components to their correct PCB footprints early in the process. Catching mismatches now prevents delays and costly rework during PCB layout. 

• Preliminary Bill of Materials (BOM): Generate a draft BOM from the schematic. This helps estimate costs, check part availability, and guide procurement planning before finalizing the design. 

Electrical Rule Check (ERC) Hygiene 

• Detects floating pins that may cause undefined behavior. 

• Flags shortened nets that could result in functional failure. 

• Ensures power and ground connections are consistent across the design. 

Circuit Test and Validation 

• Add test points on important signals and power rails so measurements can be made easily during debugging and production testing. 

• Provide programming and debug headers such as JTAG, SWD, or UART to load firmware, check signals, and communicate with the system during development. 

• Use current-limited power supplies when powering the PCB for the first time. This protects components from damage if there are shorts or design mistakes. 

• Power up and validate each subsystem separately before running the entire system together. This makes it easier to isolate and fix problems. 

• Compare all measured results against the original design specifications. Check thermal limits, timing performance, and power efficiency to be sure the circuit works as intended. 

• Keep detailed bring-up notes and test results. This documentation helps with future revisions, troubleshooting, and handoff to production teams. 

Conclusion 

Electronic circuit design combines planning, simulation, and testing to create reliable systems. From setting specifications to PCB layout and validation, each step ensures circuits work as intended under real conditions. By applying good design and standards, you can develop safe, efficient, and long-lasting electronic solutions. 

Frequently Asked Questions  

Q1. What software is used for electronic circuit design? 

Altium Designer, KiCad, Eagle, and OrCAD are common for schematics and PCB layout. LTspice, Multisim, and PSpice are often used for simulations. 

Q2. How does grounding affect a circuit? 

Proper grounding reduces noise and interference. Ground planes, star grounding, and separating analog and digital grounds improve stability. 

Q3. Why is thermal management needed in circuits? 

Excess heat shortens component life and reduces performance. Heat sinks, thermal vias, copper pours, and airflow help control temperature. 

Q4. What files are required to make a PCB? 

Gerber files, drill files, a Bill of Materials (BOM), and assembly drawings are needed for accurate PCB fabrication and assembly. 

Q5. How is signal integrity tested? 

Oscilloscopes, time-domain reflectometry (TDR), and network analyzers check impedance, crosstalk, and distortion. 

Q6. What is design for manufacturability (DFM)? 

DFM means creating circuits that are easy to produce by using standard footprints, following PCB limits, and simplifying assembly.